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800 nm laser

Analytical Characterization of CFRP Laser Treated by Excimer Laser Radiation

Analytical Characterization of CFRP Laser Treated by Excimer Laser Radiation

…kinetic energy and number of electrons that escape from the top 1 to 10 nm of the material being analyzed. Figure 4 shows the XPS spectra of a untreated specimen and specimens treated by different pulse energies (600 mJ/cm2 and 800 mJ/cm2 ) and different number of pulses (from 2 to 48 Pulses). The…

Laser activated vapour phase processes.qxd

Laser activated vapour phase processes.qxd

…1c Fig. 1: Dopand diffusion from a 10 nm thick highly boron doped layer (1a) during an 800 °C temperature step (1b) and a 700 °C temperature step (1c). Excimer Laser Why Excimer Laser? · Short Wavelength necessary for molecule dissociation · Wavelength of 193 nm suitable for a wide range of process…

Laser activated vapour phase processes.qxd

Laser activated vapour phase processes.qxd

…1c Fig. 1: Dopand diffusion from a 10 nm thick highly boron doped layer (1a) during an 800 °C temperature step (1b) and a 700 °C temperature step (1c). Excimer Laser Why Excimer Laser? · Short Wavelength necessary for molecule dissociation · Wavelength of 193 nm suitable for a wide range of process…

Analytical Characterization of CFRP Laser Treated by Excimer Laser Radiation

Analytical Characterization of CFRP Laser Treated by Excimer Laser Radiation

…fluences between 400 and 800 mJ/cm2 were applied, and the number of pulses per area was varied between 1 and 48 pulses. In the experiments, the laser pulse frequency was selectable between 1 and 50 Hz. However, as to potential process upscaling, 308 nm excimer lasers with up to 500 Watt output…

Laser activated vapour phase processes.qxd

Laser activated vapour phase processes.qxd

…Excimer Laser (wavelength 193 nm) with an ultra high vacuum process chamber with a multi gas inlet equipped for the use with up to four process gases. In principle there are two possibilities to guide the laser beam with respect to the wafer surface: normal or parallel. Guiding the laser beam normal…

Laser activated vapour phase processes.qxd

Laser activated vapour phase processes.qxd

…Excimer Laser (wavelength 193 nm) with an ultra high vacuum process chamber with a multi gas inlet equipped for the use with up to four process gases. In principle there are two possibilities to guide the laser beam with respect to the wafer surface: normal or parallel. Guiding the laser beam normal…

Analytical Characterization of CFRP Laser Treated by Excimer Laser Radiation

Analytical Characterization of CFRP Laser Treated by Excimer Laser Radiation

…and High repetition rate, line-narrowed excimer laser models are found to operate at 10 mJ per pulse and up to 6 kHz pulse frequency with narrowed bandwidth of 0.35 pm (FWHM) in advanced photolithography scanners producing computer chips with 45 nm feature size. Output energies over 1 Joule per…

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

www.Coherent.com I tech.sales@coherent.com I (800) 527-3786 I (408) 764-4983 3 In contrast, the 308 nm ultraviolet light emitted by excimer lasers is absorbed very near the glass/adhesive interface, penetrating only just a few hundred nanometers. Thus, it leaves the thin wafer entirely unaffected.…

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

www.Coherent.com I tech.sales@coherent.com I (800) 527-3786 I (408) 764-4983 3 In contrast, the 308 nm ultraviolet light emitted by excimer lasers is absorbed very near the glass/adhesive interface, penetrating only just a few hundred nanometers. Thus, it leaves the thin wafer entirely unaffected.…

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

…diameter thin wafer excimer laser debonding indicate a reasonable throughput of at least 60 wafers per hour already for modest excimer laser operation at 20 Hz repetition rate. Excimer Laser Parameters and Wafer Throughput Wafer Size 200mm 300mm Wavelength 308 nm 308 nm Fluence 250 mJ/cm2 250 mJ/cm2…

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

…diameter thin wafer excimer laser debonding indicate a reasonable throughput of at least 60 wafers per hour already for modest excimer laser operation at 20 Hz repetition rate. Excimer Laser Parameters and Wafer Throughput Wafer Size 200mm 300mm Wavelength 308 nm 308 nm Fluence 250 mJ/cm2 250 mJ/cm2…

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

…temperatures is avoided anyway. Layer Selective Debonding with Excimer Lasers The laser debonding process is conducted with a 308 nm excimer laser. UV lasers work via a cold process very much different from infrared lasers. IR lasers penetrate far into the adhesive layer and easily cause debonding…

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