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Cleaving

Photonics Spectra - March 2018

Photonics Spectra - March 2018

…this cutting technique have utilized
picosecond lasers. Several display manufacturers now make extensive use of these
systems, which can cleave virtually any
glass type at speeds up to 2 m/s and glass
thicknesses up to 10 mm.
However, one limitation in some applications is…

COHR UMCs 780-830nm DS 0517 1.pdf

COHR UMCs 780-830nm DS 0517 1.pdf

…NOTES:
Unless otherwise specified, unmounted chips are delivered in the form of multi-emitter chip-bars and customer is responsible for cleaving the bar into chips.
OPERATION NOTES:
Negative current transients greater than 25 µA and/or reverse voltages >3V can destroy the device.…

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