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Cleaving

Photonics Spectra - March 2018

Photonics Spectra - March 2018

…this cutting technique have utilized
picosecond lasers. Several display manufacturers now make extensive use of these
systems, which can cleave virtually any
glass type at speeds up to 2 m/s and glass
thicknesses up to 10 mm.
However, one limitation in some applications is…

COHR UMCs 780-830nm DS 0517 1.pdf

COHR UMCs 780-830nm DS 0517 1.pdf

…NOTES:
Unless otherwise specified, unmounted chips are delivered in the form of multi-emitter chip-bars and customer is responsible for cleaving the bar into chips.
OPERATION NOTES:
Negative current transients greater than 25 µA and/or reverse voltages >3V can destroy the device.…

Coherent-new-lasers-improve-glass-cutting-methods wp.pdf

Coherent-new-lasers-improve-glass-cutting-methods wp.pdf

…- further expands the process window and applications range for two of the most popular methods, cleaving and laser scribing. Specifically, we see how the new Monaco laser series extends cleaving to mixed (e.g., laminates) substrates, such as polyimide on glass, and how the CO laser now enables…