Search Results


Result Type

1 - 2 of 2 Products for 'Cleaving' Page 1 of 1 |
  • 1


Photonics Spectra - March 2018

Photonics Spectra - March 2018

…this cutting technique have utilized
picosecond lasers. Several display manufacturers now make extensive use of these
systems, which can cleave virtually any
glass type at speeds up to 2 m/s and glass
thicknesses up to 10 mm.
However, one limitation in some applications is…

COHR UMCs 780-830nm DS 0517 1.pdf

COHR UMCs 780-830nm DS 0517 1.pdf

Unless otherwise specified, unmounted chips are delivered in the form of multi-emitter chip-bars and customer is responsible for cleaving the bar into chips.
Negative current transients greater than 25 µA and/or reverse voltages >3V can destroy the device.…

Please Read Before Continuing

Risk factors: Except for the historical information contained here, many of the matters discussed in this Web site are forward-looking statements, based on expectations at the time they were made, that involve risks and uncertainties that could cause our results to differ materially from those expressed or implied by such statements. These risks are detailed in the “Factors That May Affect Future Results” section of our latest 10-K or 10-Q filing. Coherent assumes no obligation to update these forward-looking statements.

I have read the terms and conditions