Search Results

Refine

Result Type

1 - 8 of 8 Products for 'Debond' Page 1 of 1 |
  • 1

Debond

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

…thermal or chemical debonding, which utilize
silicon carriers, laser induced debonding requires the
use of glass carriers. In CMOS fabs, where ionic
species are particularly undesirable, glass carriers are
problematic to implement. So, laser debonding is likely
to coexist…

EU Photonics Flexible Displays.pdf

EU Photonics Flexible Displays.pdf

…and optical
performance characteristics to support
square centimeter scale processing areas with optimum beam geometry for
fast debonding of carrier wafers up to
300 mm diameter as well as for detaching large display glass substrates.
Author
Ralph Delmdahl is

Microsoft Word - Coherent Whitepaper - Laser Processing of µLED

Microsoft Word - Coherent Whitepaper - Laser Processing of µLED

…sapphire
carrier
substrate with active matrix
attach temporary carrier
transfer dies to substrate
pitch
die size
de-bond sapphire wafer
RGB Epi Wafer with µLED µLED dies
LLO
LIFT
Figure 9. Sketch for LED assembly using LLO and LIFT.
In a…

Photonik Feb2014.pdf

Photonik Feb2014.pdf

…glass
carriers and laser lift-off
release because there is no
need for investing in new
production equipment.
Laser debonding
of thin wafers
The increasing functional
density and the on-going
miniaturization in consumer
electronics drive the…

COHR ExcimerCatalog2019.pdf

COHR ExcimerCatalog2019.pdf

Superior Reliability & Performance
16
COMPex
Market Leading UV-Technology
COMPex Excimer lasers are highly effective light sources, featuring
a compact design and easy installation and operation. They deliver
superior results in demanding applications, such as solid…

COHR COMPexSeries DS 0618 8.pdf

COHR COMPexSeries DS 0618 8.pdf

COMPex Market Leading UV-Technology COMPex Excimer lasers are highly effective light sources, featuring a compact design and easy installation and operation. They deliver superior results in demanding applications, such as solid sampling systems (LA-ICPMS), material research (PLD) and precise…

COHR PowerLine AVIANX DS 0519.pdf

COHR PowerLine AVIANX DS 0519.pdf

…enables high-speed processing · Extended UV lifetime ensures low operating costs · Configurable with many optional features APPLICATIONS · PCB Cutting · IC Package Cutting · Flex-PCB Cutting and Drilling · Laser Lift-Off (LLO) · System-in-Package Cutting · Scribing and Trenching · Wafer De-Bonding

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

…with high precision and minimal heat affected zone (HAZ). As a result, laser use is increasing in wafer dicing, package singulation, optical debonding, µ-via drilling, RDL (redistribution layer) structuring, dicing tape cutting (EMI shield), soldering, annealing and bonding, to name just a few.…