…· Exceeding 48 VDC input · Mishandling, improper mounting, or unauthorized modifications to the laser head. · Back-reflection occurring during cutting, welding, or setup. · Operating outside dew point, proper temperature, or hardness. This is not an exhaustive list of failure conditions--refer to…
…wavelengths - 9.3 µm, 10.2 µm, and 10.6 µm · Wide power range with constant wave (CW) or pulse width modulation (PWM) control · Air and liquid cooled configurations available · High quality laser processing on a wide range of materials APPLICATIONS · Marking · Engraving · Cutting Diamond C-30 Series
…HERE META 2C Highlights
* 250W CO2 Laser
* Cuts up to 25 mm acrylic
* Metal cutting option available Datasheet META 2C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Glass Cutting & Drilling Marking Brazing Cutting Drilling ABS Acrylic Wood and Derivatives…
…an ideal laser for a wide range of materials processing applications. Datasheet DIAMOND E-1000 Applications Application Process Material Advanced Packaging and Interconnects Materials Processing Graphic Arts Cutting Drilling Printing Scribing Flex Circuit Die Board Metal Plastic Flat Panel Display…
…pulse control and power stability Pulse Picking, FPD Film Cutting, High-Resolution Marking 10.2μm 9.6μm 9.3μm Cx-10LQS 120 W 9.3μm Short laser pulses with high peak power FPD Film Cutting, High-Resolution Marking Coherent’s DIAMOND C-Series and Cx-Series sealed CO2 lasers are the best power–size…
--> DIAMOND J-3-5 CO Laser - 5µm CO Lasers Offer Enhanced Capabilities for Industrial and Medical Applications A new generation of carbon monoxide (CO) lasers from Coherent, promise enhanced processing characteristics in applications ranging from glass, ceramic and film cutting and drilling, through…
--> DIAMOND J-Series The J-Series CO 2 lasers, built on a common platform, pack a host of high performance features ideal for high demanding materials processing applications. Contact Us About This Product Close PRICE HERE RF-Excited OEM Industrial CO 2 Laser DIAMOND J-Series are compact, sealed, CO…
…HERE META 1.5C Highlights
* 150W CO2 Laser
* Cuts up to 15 mm acrylic
* Metal cutting option available Datasheet META 1.5C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Etch Barrier Patterning Marking Cutting Drilling Engraving Wood and Derivatives Acrylic…
…- 5µm DIAMOND J-3-5 CO Laser - 5µm New generation of carbon monoxide (CO) lasers from Coherent, promise enhanced processing characteristics in applications ranging from glass, ceramic, and film cutting and drilling, through medical and aesthetics fractional skin resurfacing. DIAMOND J-Series DIAMOND…
…scanner is recommended when cutting acrylics or laser cutting wood when the material to be cut is very thin or very heat sensitive. Related Products DIAMOND C-Series DIAMOND E-Series DIAMOND J-Series Laser Cutting Systems Metal Cutting Cost-effective, precision cutting of metals at varying…
…down time. Related Products IndyStar Excimer Laser ExciStar Paladin Compact 355 Sapphire LP/LPX Sapphire Lasers Ion Lasers Si Wafer Scribing, Cutting and Dicing Coherent lasers are used in a large number of advanced silicon wafer applications, both in high-volume production and in the development…
…cutting leaves significant mechanical stress in the finished edge. (In fact, it becomes difficult to use mechanical cutting at all with substrates below about 1 mm in thickness because the glass is so easily broken). To prevent further cracking or breaking of the glass after the original cut, it may…