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Diamond Cutting

COHR DIAMOND C-30 DS 0817 1.pdf

COHR DIAMOND C-30 DS 0817 1.pdf

…wavelengths - 9.3 µm, 10.2 µm, and 10.6 µm · Wide power range with constant wave (CW) or pulse width modulation (PWM) control · Air and liquid cooled configurations available · High quality laser processing on a wide range of materials APPLICATIONS · Marking · Engraving · Cutting Diamond C-30 Series

DIAMOND E-Series

DIAMOND E-Series

…an ideal laser for a wide range of materials processing applications. Datasheet DIAMOND E-1000 Applications Application Process Material Advanced Packaging and Interconnects Materials Processing Graphic Arts Cutting Drilling Printing Scribing Flex Circuit Die Board Metal Plastic Flat Panel Display…

Diamond g50 100 Quiksetup.pdf

Diamond g50 100 Quiksetup.pdf

…· Exceeding 48 VDC input · Mishandling, improper mounting, or unauthorized modifications to the laser head. · Back-reflection occurring during cutting, welding, or setup. · Operating outside dew point, proper temperature, or hardness. This is not an exhaustive list of failure conditions--refer to…

META 2C | Laser Cutting and Machining Tool

META 2C | Laser Cutting and Machining Tool

…HERE META 2C Highlights
* 250W CO2 Laser
* Cuts up to 25 mm acrylic
* Metal cutting option available Datasheet META 2C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Glass Cutting & Drilling Marking Brazing Cutting Drilling ABS Acrylic Wood and Derivatives…

DIAMOND J-3-5 CO Laser - 5µm

DIAMOND J-3-5 CO Laser - 5µm

--> DIAMOND J-3-5 CO Laser - 5µm CO Lasers Offer Enhanced Capabilities for Industrial and Medical Applications A new generation of carbon monoxide (CO) lasers from Coherent, promise enhanced processing characteristics in applications ranging from glass, ceramic and film cutting and drilling, through…

DIAMOND C-Series

DIAMOND C-Series

…Pulse Picking, FPD Film Cutting, High-Resolution Marking 40 W 10.2μm 30 W 9.6μm 30 W 9.3μm Cx-10LQS 50 W 9.3μm Short laser pulses with high peak power FPD Film Cutting, High-Resolution Marking
*see a product datasheet(s) for specific conditions Coherent’s DIAMOND C-Series and Cx-Series sealed…

DIAMOND J-Series Lasers

DIAMOND J-Series Lasers

--> DIAMOND J-Series The J-Series CO 2 lasers, built on a common platform, pack a host of high performance features ideal for high demanding materials processing applications. Contact Us About This Product Close PRICE HERE RF-Excited OEM Industrial CO 2 Laser DIAMOND J-Series are compact, sealed, CO…

META 1.5C | Compact and Flexible Laser Cutter

META 1.5C | Compact and Flexible Laser Cutter

…HERE META 1.5C Highlights
* 150W CO2 Laser
* Cuts up to 15 mm acrylic
* Metal cutting option available Datasheet META 1.5C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Etch Barrier Patterning Marking Cutting Drilling Engraving Wood and Derivatives Acrylic…

CO and CO2 Lasers

CO and CO2 Lasers

…- 5µm DIAMOND J-3-5 CO Laser - 5µm New generation of carbon monoxide (CO) lasers from Coherent, promise enhanced processing characteristics in applications ranging from glass, ceramic, and film cutting and drilling, through medical and aesthetics fractional skin resurfacing. DIAMOND J-Series DIAMOND

COHR USP lasers in circuit drilling cutting article 0420.pdf

COHR USP lasers in circuit drilling cutting article 0420.pdf

…www.laserfocusworld.com.cn 13
Mar/ Apr 2020

PCB
PCB

PCB PCB
50~100µm
PCB

PCB
CO2

Coherent
DIAMOND

50µm
CO2

2
Coherent
HyperRapid NX

2000kHz

PCB

PCB

100µm

20
2000
3 1.2mm SiP HyperRapid…

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

cutting leaves significant mechanical stress in the finished edge. (In fact, it becomes difficult to use mechanical cutting at all with substrates below about 1 mm in thickness because the glass is so easily broken). To prevent further cracking or breaking of the glass after the original cut, it may…

Whitepaper - USP Lasers Deliver Cleaner Cuts for Semiconductor Packaging.pdf

Whitepaper - USP Lasers Deliver Cleaner Cuts for Semiconductor Packaging.pdf

…the cutting requirements for singulation already surpass the capabilities of mechanical cutting. Specific examples are System-in-Package (SiP) circuitry used in wrist-worn devices and the fingerprint sensors found in many phones, tablets or even smart watches. This leaves laser cutting as the…