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Diamond Cutting

Diamond g50 100 Quiksetup.pdf

Diamond g50 100 Quiksetup.pdf

…· Exceeding 48 VDC input · Mishandling, improper mounting, or unauthorized modifications to the laser head. · Back-reflection occurring during cutting, welding, or setup. · Operating outside dew point, proper temperature, or hardness. This is not an exhaustive list of failure conditions--refer to…

COHR DIAMOND C-30 DS 0817 1.pdf

COHR DIAMOND C-30 DS 0817 1.pdf

…wavelengths - 9.3 µm, 10.2 µm, and 10.6 µm · Wide power range with constant wave (CW) or pulse width modulation (PWM) control · Air and liquid cooled configurations available · High quality laser processing on a wide range of materials APPLICATIONS · Marking · Engraving · Cutting Diamond C-30 Series

META 2C | Laser Cutting and Machining Tool

META 2C | Laser Cutting and Machining Tool

…HERE META 2C Highlights
* 250W CO2 Laser
* Cuts up to 25 mm acrylic
* Metal cutting option available Datasheet META 2C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Glass Cutting & Drilling Marking Brazing Cutting Drilling ABS Acrylic Wood and Derivatives…

DIAMOND E-Series

DIAMOND E-Series

…an ideal laser for a wide range of materials processing applications. Datasheet DIAMOND E-1000 Applications Application Process Material Advanced Packaging and Interconnects Materials Processing Graphic Arts Cutting Drilling Printing Scribing Flex Circuit Die Board Metal Plastic Flat Panel Display…

DIAMOND C-Series

DIAMOND C-Series

…pulse control and power stability Pulse Picking, FPD Film Cutting, High-Resolution Marking 10.2μm 9.6μm 9.3μm Cx-10LQS 120 W 9.3μm Short laser pulses with high peak power FPD Film Cutting, High-Resolution Marking Coherent’s DIAMOND C-Series and Cx-Series sealed CO2 lasers are the best power–size…

DIAMOND J-3-5 CO Laser - 5µm

DIAMOND J-3-5 CO Laser - 5µm

--> DIAMOND J-3-5 CO Laser - 5µm CO Lasers Offer Enhanced Capabilities for Industrial and Medical Applications A new generation of carbon monoxide (CO) lasers from Coherent, promise enhanced processing characteristics in applications ranging from glass, ceramic and film cutting and drilling, through…

DIAMOND J-Series Lasers

DIAMOND J-Series Lasers

--> DIAMOND J-Series The J-Series CO 2 lasers, built on a common platform, pack a host of high performance features ideal for high demanding materials processing applications. Contact Us About This Product Close PRICE HERE RF-Excited OEM Industrial CO 2 Laser DIAMOND J-Series are compact, sealed, CO…

META 1.5C | Compact and Flexible Laser Cutter

META 1.5C | Compact and Flexible Laser Cutter

…HERE META 1.5C Highlights
* 150W CO2 Laser
* Cuts up to 15 mm acrylic
* Metal cutting option available Datasheet META 1.5C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Etch Barrier Patterning Marking Cutting Drilling Engraving Wood and Derivatives Acrylic…

CO and CO2 Lasers

CO and CO2 Lasers

…- 5µm DIAMOND J-3-5 CO Laser - 5µm New generation of carbon monoxide (CO) lasers from Coherent, promise enhanced processing characteristics in applications ranging from glass, ceramic, and film cutting and drilling, through medical and aesthetics fractional skin resurfacing. DIAMOND J-Series DIAMOND

Materials Processing & Industrial Applications

Materials Processing & Industrial Applications

…scanner is recommended when cutting acrylics or laser cutting wood when the material to be cut is very thin or very heat sensitive. Related Products DIAMOND C-Series DIAMOND E-Series DIAMOND J-Series Laser Cutting Systems Metal Cutting Cost-effective, precision cutting of metals at varying…

Microelectronics

Microelectronics

…down time. Related Products IndyStar Excimer Laser ExciStar Paladin Compact 355 Sapphire LP/LPX Sapphire Lasers Ion Lasers Si Wafer Scribing, Cutting and Dicing Coherent lasers are used in a large number of advanced silicon wafer applications, both in high-volume production and in the development…

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

cutting leaves significant mechanical stress in the finished edge. (In fact, it becomes difficult to use mechanical cutting at all with substrates below about 1 mm in thickness because the glass is so easily broken). To prevent further cracking or breaking of the glass after the original cut, it may…