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Dicing

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…years now, specifically for semiconductor wafer dicing and glass cutting. Joshua Zhao, sales manager at Suzhou Delphi Laser Co. for the Americas region, discussed how the lasers are employed and the benefits they have delivered. "Wafer dicing can actually be accomplished in two different ways.…

Talisker-Ultra-1064-16-Short-Head-Data-Sheet.pdf

Talisker-Ultra-1064-16-Short-Head-Data-Sheet.pdf

…· PermAlignTM solder-bonded optics technology · Ultra-long-life AAATM (Aluminum-free Active Area) laser diode material Talisker Ultra 1064-16 Applications: · Micromachining · LED Dicing · Patterning Layered Materials · Wafer Scribing · Engraving www.Coherent.com/TaliskerUltra Talisker Ultra 1064-16

RAPID NX

RAPID NX

…features of the RAPID-series lasers at a lower power level and entry price. The system is designed for demanding specialty marking, engraving and LED dicing applications. The included intuitive software controls all laser functions via internal embedded processor. An optional DLL allows the user to…

MATRIX QS DPSS Lasers

MATRIX QS DPSS Lasers

…control concept
* Excellent beam parameters: - Fine and micro processing capabilities/micrometer precision - Reduced danger of work piece damage (dicing saws, scribers, drills) - No tool ware necessary - Cost savings - Easier handling - Increase in flexibility - Environmental friendly - Just-in-Time…

HELIOS

HELIOS

HELIOS Coherent HELIOS lasers, in the IR and the Green, allow for picosecond precision in a varity of micromachining and microelectronics applications. The high peak power from pulse durations as low as a few hundred picoseconds allows HELIOS to deliver an effective number of photons to the sample.…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…years now, specifically for semiconductor wafer dicing and glass cutting. Joshua Zhao, sales manager at Suzhou Delphi Laser Co. for the Americas region, discussed how the lasers are employed and the benefits they have delivered. "Wafer dicing can actually be accomplished in two different ways.…

COHR HELIOS DS 0117 2.pdf

COHR HELIOS DS 0117 2.pdf

…easy and quick wavelength change. HELIOS lasers are the right economic choice for surface-near applications like thin-film processing, scribing, dicing, and marking. FEATURES · Pulse-width: 600 ps to 900 ps · High output power - Up to 6W at 1064 nm - Up to 3.75W at 532 nm · Repetition rate from…

COHR HELIOS DS 0217 3.pdf

COHR HELIOS DS 0217 3.pdf

…easy and quick wavelength change. HELIOS lasers are the right economic choice for surface-near applications like thin-film processing, scribing, dicing, and marking. FEATURES · Pulse-width: 600 ps to 900 ps · High output power - Up to 6W at 1064 nm - Up to 3.75W at 532 nm · Repetition rate from…

COHR HELIOS DS 0217 3.pdf

COHR HELIOS DS 0217 3.pdf

…easy and quick wavelength change. HELIOS lasers are the right economic choice for surface-near applications like thin-film processing, scribing, dicing, and marking. FEATURES · Pulse-width: 600 ps to 900 ps · High output power - Up to 6W at 1064 nm - Up to 3.75W at 532 nm · Repetition rate from…

RAPID-NX-Data-Sheet-06-23-14.pdf

RAPID-NX-Data-Sheet-06-23-14.pdf

…of the existing RAPIDseries at a significantly reduced cost of ownership.Thus, the RAPID NX is ideally suited for sophisticated marking, LED dicing, thin film removal, and small feature structuring.The short pulses facilitate non-thermal material processing thereby avoiding recast, micro-cracks,…

RAPID-NX-Data-Sheet-06-23-14.pdf

RAPID-NX-Data-Sheet-06-23-14.pdf

…of the existing RAPIDseries at a significantly reduced cost of ownership.Thus, the RAPID NX is ideally suited for sophisticated marking, LED dicing, thin film removal, and small feature structuring.The short pulses facilitate non-thermal material processing thereby avoiding recast, micro-cracks,…

RAPID-NX-Data-Sheet-06-23-14.pdf

RAPID-NX-Data-Sheet-06-23-14.pdf

…of the existing RAPIDseries at a significantly reduced cost of ownership.Thus, the RAPID NX is ideally suited for sophisticated marking, LED dicing, thin film removal, and small feature structuring.The short pulses facilitate non-thermal material processing thereby avoiding recast, micro-cracks,…

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