Search Results

1 - 11 of 11 Products for 'Dicing' Page 1 of 1 |
  • 1

Dicing

Microelectronics

Microelectronics

…ExciStar Paladin Compact 355 Sapphire LP/LPX Related Product Families Sapphire Lasers Laser Machines and Systems Si Wafer Scribing, Cutting and Dicing Coherent lasers are used in a large number of advanced silicon wafer applications, both in high-volume production and in the development of…

RAPID NX Laser

RAPID NX Laser

…features of the RAPID-series lasers at a lower power level and entry price. The system is designed for demanding specialty marking, engraving and LED dicing applications. The included intuitive software controls all laser functions via internal embedded processor. An optional DLL allows the user to…

MATRIX Family of Q-Switch Lasers | Coherent

MATRIX Family of Q-Switch Lasers | Coherent

…control concept
* Excellent beam parameters: - Fine and micro processing capabilities/micrometer precision - Reduced danger of work piece damage (dicing saws, scribers, drills) - No tool ware necessary - Cost savings - Easier handling - Increase in flexibility - Environmental friendly - Just-in-Time…

HELIOS

HELIOS

HELIOS Coherent HELIOS lasers, in the IR and the Green, allow for picosecond precision in a variety of micromachining and microelectronics applications. The high peak power from pulse durations as low as a few hundred picoseconds allows HELIOS to deliver an effective number of photons to the sample.…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…specifically
for semiconductor wafer dicing and
glass cutting. Joshua Zhao, sales manager at Suzhou Delphi Laser Co. for the
Americas region, discussed how the lasers are employed and the benefits they
have delivered. "Wafer dicing can actually be accomplished in two different…

COHR HELIOS DS 0217 3.pdf

COHR HELIOS DS 0217 3.pdf

…easy and quick wavelength change. HELIOS lasers are the right economic choice for surface-near applications like thin-film processing, scribing, dicing, and marking. FEATURES · Pulse-width: 600 ps to 900 ps · High output power - Up to 6W at 1064 nm - Up to 3.75W at 532 nm · Repetition rate from…

RAPID-NX-Data-Sheet-06-23-14.pdf

RAPID-NX-Data-Sheet-06-23-14.pdf

…of the existing RAPIDseries at a significantly reduced cost of ownership.Thus, the RAPID NX is ideally suited for sophisticated marking, LED dicing, thin film removal, and small feature structuring.The short pulses facilitate non-thermal material processing thereby avoiding recast, micro-cracks,…

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

…precision and minimal heat affected zone (HAZ). As a result, laser use is increasing in wafer dicing, package singulation, optical debonding, µ-via drilling, RDL (redistribution layer) structuring, dicing tape cutting (EMI shield), soldering, annealing and bonding, to name just a few. In this…

Helios Whitepaper2014.pdf

Helios Whitepaper2014.pdf

…and/or delicate materials, such as silicon,
which are difficult to machine using traditional
mechanical methods. For example, when dicing silicon
wafers used in semiconductor device fabrication, it is
especially essential that the cutting process doesn't
produce significant…

Photonics Spectra - July 2017

Photonics Spectra - July 2017


A semiconductor laser, in this case for a VCSEL (vertical-cavity surface-emitting laser), being loaded into an
automated bonding machine as part of the production process.
Microscopic inspection of VCSEL dice for quality control.
Philips Photonics
Philips Photonics

Photonics Spectra - September 2016

Photonics Spectra - September 2016

…The
length of the line ideally matches either the
half or full width of the panel; hundreds of
smartphone displays are eventually diced
from each panel. The panel is translated
under the line beam inside an ambient controlled chamber, ideally in a single-pass or
in a…

Powered by Site Search powered by SLI Systems

Please Read Before Continuing

Risk factors: Except for the historical information contained here, many of the matters discussed in this Web site are forward-looking statements, based on expectations at the time they were made, that involve risks and uncertainties that could cause our results to differ materially from those expressed or implied by such statements. These risks are detailed in the “Factors That May Affect Future Results” section of our latest 10-K or 10-Q filing. Coherent assumes no obligation to update these forward-looking statements.


I have read the terms and conditions