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Dicing Led

Microelectronics

Microelectronics

…laser-lift-off (LLO) processing with 193 nm and 248 nm excimer lasers enable vertical LED structures with increased light extraction efficiency. Laser-based sapphire scribing, as well as wafer or substrate dicing with diode-pumped solid-state lasers at 266 nm and 355 nm or picosecond lasers, further…

RAPID NX Laser

RAPID NX Laser

…features of the RAPID-series lasers at a lower power level and entry price. The system is designed for demanding specialty marking, engraving and LED dicing applications. The included intuitive software controls all laser functions via internal embedded processor. An optional DLL allows the user to…

RAPID-NX-Data-Sheet-06-23-14.pdf

RAPID-NX-Data-Sheet-06-23-14.pdf

…of the existing RAPIDseries at a significantly reduced cost of ownership.Thus, the RAPID NX is ideally suited for sophisticated marking, LED dicing, thin film removal, and small feature structuring.The short pulses facilitate non-thermal material processing thereby avoiding recast, micro-cracks,…

COHR HELIOS DS 0217 3.pdf

COHR HELIOS DS 0217 3.pdf

…at 532 nm · Repetition rate from single-shot up to 125 kHz · Exact pulse control · High beam quality: TEM00/M2 <1.25 · Excellent pointing stability APPLICATIONS · Thin-Film Scribing · LED Dicing · Marking, Engraving - Ceramics, Glass, Sapphire, Diamond · Repair - Displays, Memories, etc. HELIOS

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…precision, quality and smallest HAZ. From sapphire cutting to LED dicing Because of their advantages, ultrafast processing lasers have now been adopted in a number of demanding, high-precision applications. These include LED dicing; sapphire cutting; drilling of automobile engine fuel injection…

Helios Whitepaper2014.pdf

Helios Whitepaper2014.pdf

…marking the sapphire wafers used as
substrates in the production of high brightness LEDs.
These marks are typically lot numbers and other
identifying information placed on the sapphire after LED
structures have been created, i.e., after a significant
amount of cost has been…

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