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Drilling

PowerLine AVIA NX UV Laser Sub-System for micromachining applications

PowerLine AVIA NX UV Laser Sub-System for micromachining applications

…development. Once in service, all system parameters can be easily varied and optimized for a specific task by the user via its Window 10 IoT based software. Datasheet PowerLine AVIA NX Applications Application Wafer Scribing Laser Lift-Off Flex PCB drilling & cutting IC Package singulation -->

Monaco femtosecond laser

Monaco femtosecond laser

…Applications Application Process Material Choose an Application Glass Cutting & Drilling OPA Pumping fs Micromachining Precise Metal Marking & Cutting Thin-film Ablation Wafer Scribing Display Cutting Drilling Scribing Marking Surface Modification Glass Polymer Ceramic Thin Film Stainless Steel…

META 2C | Laser Cutting and Machining Tool

META 2C | Laser Cutting and Machining Tool

…available Datasheet META 2C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Glass Cutting & Drilling Marking Brazing Cutting Drilling ABS Acrylic Wood and Derivatives Ceramic Plastic --> Features & Benefits META 2C Processing Capabilities:
* Acrylic
* ABS
*…

META 1.5C | Compact and Flexible Laser Cutter

META 1.5C | Compact and Flexible Laser Cutter

…Datasheet META 1.5C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Etch Barrier Patterning Marking Cutting Drilling Engraving Wood and Derivatives Acrylic ABS Ceramic --> Features & Benefits META 1.5C Processing Capabilities:
* Acrylic
* ABS
* Wood
* And…