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Epoxy

Materials Processing & Industrial Applications

Materials Processing & Industrial Applications

…approximation to the finished product is desired. Stereolithography (SLA) typically uses a low power UV laser to selectively harden a photosensitive epoxy polymer in a bath to form a part. Key benefits of SLA are high accuracy and smooth surface finish of parts. Related Products Coherent CREATOR -…

SST 2017-09 Laser Marking.pdf

SST 2017-09 Laser Marking.pdf

…µmorlessisrequired. Increasingly,greenlasersareused
for this type of shallow marking because of a stronger
absorption at this wavelength by the epoxy matrix.
Ceramics
The process window when marking ceramics, such
as used in packaging power semiconductors, highbrightness…

COHR MaterialsProcessingBrochure 0816revA 3.pdf

COHR MaterialsProcessingBrochure 0816revA 3.pdf

…required to be fabricated quickly
without the need of complex tooling.The process is differentiated between Stereolithography (SLA) using an epoxy polymer and Selective
Laser Sintering (SLM) using metal or ceramic powder. In both the SLA
and SLM processes, a 3-D CAD model is sliced…

Industrial Laser Solutions - January / February 2014

Industrial Laser Solutions - January / February 2014

…fbers such as Kevlar, aluminum, or glass are also often added. The matrix, which surrounds the reinforcement and binds it together, is most commonly epoxy or some other polymer resin. CFRP components are manufactured in all shapes and sizes with various technologies like tape laying, molding, resin…

ExcimerCFRPCleaning.pdf

ExcimerCFRPCleaning.pdf

…parts need to be joined in a non-destructive manner. To this end, aerospace and automotive industries employ adhesive bonding, often based on epoxy resin and polyurethane, wherever possible. In order to join two composite parts reliably and permanently, as a first step, any remnants of release…

Industrial Laser Solutions - September/October 2015

Industrial Laser Solutions - September/October 2015

…Excimer laser ablation is
the cost-effective patterning method for
non-photo dielectrics and advanced composites, such as silica-filled epoxy mold
compounds. It involves fewer steps than
photodefinable dielectric patterning and
eliminates wet chemicals for an overall

COHR AILU CO Lasers 08-18.pdf

COHR AILU CO Lasers 08-18.pdf

…faster via production, with the shorter
wavelength CO laser.
The most common polymers used for PCBs
are FR4, a fiberglass and epoxy composite.
The CO laser wavelength is well absorbed by
FR4, enabling high efficiency drilling. Use of the
CO laser with other materials…

USP Lasers Semiconductor Packaging Whitepaper.pdf

USP Lasers Semiconductor Packaging Whitepaper.pdf

…can cut a 0.45 mm thick substrate at
speeds of >75 mm/s. This speed can be maintained regardless of substrate composition (copper,
epoxy, etc.). For a typical fingerprint sensor with a 42 mm perimeter, this yields a cycle time of
0.55 s.
Figure 4. Green USP laser singulation…

Whitepaper - USP Lasers Deliver Cleaner Cuts for Semiconductor Packaging.pdf

Whitepaper - USP Lasers Deliver Cleaner Cuts for Semiconductor Packaging.pdf

…can cut a 0.45 mm thick substrate at
speeds of >75 mm/s. This speed can be maintained regardless of substrate composition (copper,
epoxy, etc.). For a typical fingerprint sensor with a 42 mm perimeter, this yields a cycle time of
0.55 s.
Figure 4. Green USP laser singulation…

Ultra-narrow-band-Tunable-Laserline-Notch-Filter-1.pdf

Ultra-narrow-band-Tunable-Laserline-Notch-Filter-1.pdf

…into direct mechanical contact to the previous VHG.
After alignment individual gratings are secured to the stack
by an index matching epoxy. This procedure ensures that the
internal incident angle M is the same for every grating in
the stack. Only the rotation angle i is used…

Ultra Narrow-Band Tunable Laserline Notch Filter.pdf

Ultra Narrow-Band Tunable Laserline Notch Filter.pdf

…into direct mechanical contact to the previous VHG.
After alignment individual gratings are secured to the stack
by an index matching epoxy. This procedure ensures that the
internal incident angle M is the same for every grating in
the stack. Only the rotation angle i is used…

Untitled-2

Untitled-2

…can cut a 0.45 mm thick substrate at speeds of >75 mm/s.
This speed can be maintained regardless of substrate
composition (copper, epoxy, etc.). For a typical fingerprint
sensor with a 42 mm
perimeter, this yields a cycle
time of 0.55 s.
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