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Flex Pcb Drilling & Cutting

AVIA NX nanosecond laser

AVIA NX nanosecond laser

…competition. Datasheet AVIA NX Green Datasheet AVIA NX Ultraviolet Applications Application µ-via drilling Glass Cutting & Drilling Thin-film Scribing Ceramic Processing Flex PCB drilling & cutting IC Package singulation Silicon Wafer scribing Fine metal machining --> Features & Benefits AVIA…

PowerLine AVIA NX UV Laser Sub-System for micromachining applications

PowerLine AVIA NX UV Laser Sub-System for micromachining applications

…development. Once in service, all system parameters can be easily varied and optimized for a specific task by the user via its Window 10 IoT based software. Datasheet PowerLine AVIA NX Applications Application Wafer Scribing Laser Lift-Off Flex PCB drilling & cutting IC Package singulation -->

Microelectronics

Microelectronics

…component for high-volume fabrication of HD flex. UV-DPSS and IR CO2 lasers offer the best overall solution to requirements set forth by flex manufacturers. Laser technology can be used for a variety of applications within the HD flex industry: microvia drilling (blind and thru), excising, skiving,…

COHR AVIA LX UV DS 0818 3.pdf

COHR AVIA LX UV DS 0818 3.pdf

…These characteristics make AVIA LX an ideal tool for high throughput, demanding, yet cost sensitive applications such as via drilling in PCB and flex materials, cutting of flex materials, 3D chip package manufacturing, IC package trimming, and wafer scribing. For the system builder, AVIA LX offers…

AVIA LX Solid State Q-Switched UV Laser

AVIA LX Solid State Q-Switched UV Laser

…These characteristics make AVIA LX an ideal tool for high throughput, demanding, yet cost sensitive applications such as via drilling in PCB and flex materials, cutting of flex materials, 3D chip package manufacturing, IC package trimming, and wafer scribing. For the system builder, AVIA LX offers…

COHR PowerLine AVIANX DS 0519.pdf

COHR PowerLine AVIANX DS 0519.pdf

…enables high-speed processing · Extended UV lifetime ensures low operating costs · Configurable with many optional features APPLICATIONS · PCB Cutting · IC Package Cutting · Flex-PCB Cutting and Drilling · Laser Lift-Off (LLO) · System-in-Package Cutting · Scribing and Trenching · Wafer De-Bonding

COHR AVIA NX UV DS 0117 5.pdf

COHR AVIA NX UV DS 0117 5.pdf

…that the AVIA NX quality and reliability levels are beyond that of any other ns laser. AVIA NX is ideal for applications such as via drilling in PCB and Flex materials, 3D chip package manufacturing, IC package trimming, and wafer scribing. The AVIA NX offers effortless ease of integration into…