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Related Categories: Fr4 Cutting | 193 Nm Laser | Polyimide

Fr4

USP Lasers Semiconductor Packaging Whitepaper.pdf

USP Lasers Semiconductor Packaging Whitepaper.pdf

…typically accounts for a little more than half this total. In volume production, multiple SiP devices are fabricated on a single substrate, typically FR4 or ceramics, which is then cut singulated to yield individual devices. Furthermore, in some cases, trenches are cut into the molding compound in…

Whitepaper - USP Lasers Deliver Cleaner Cuts for Semiconductor Packaging.pdf

Whitepaper - USP Lasers Deliver Cleaner Cuts for Semiconductor Packaging.pdf

…typically accounts for a little more than half this total. In volume production, multiple SiP devices are fabricated on a single substrate, typically FR4 or ceramics, which is then cut singulated to yield individual devices. Furthermore, in some cases, trenches are cut into the molding compound in…

Microelectronics

Microelectronics

…head. The position of the holes, as well as the shape, must fulfill very tight tolerances (50 µm diameter vias in resin-coated copper (RCC), Fr4 and aramid-based dielectrics, as well as Cu-direct drilling processes. The AVIA-series diode-pumped UV lasers are ideal for drilling <70 µm diameter…

Untitled-2

Untitled-2

…typically accounts for a little more than half this total. In volume production, multiple SiP devices are fabricated on a single substrate, typically FR4 or ceramics, which is then cut singulated to yield individual devices. Furthermore, in some cases, trenches are cut into the molding compound in…

COHR AILU CO Lasers 08-18.pdf

COHR AILU CO Lasers 08-18.pdf

…with the shorter
wavelength CO laser.
The most common polymers used for PCBs
are FR4, a fiberglass and epoxy composite.
The CO laser wavelength is well absorbed by
FR4, enabling high efficiency drilling. Use of the
CO laser with other materials depends upon

Article

Article

…highest ablation rate was
found for black rubber with 12 mm3/(W min) at 1035 nm. Materials that were measured but not mentioned
above, were FR4, PEEK, and ivory. For metals, semiconductors and plastics, the optimum average pulse
fluences were in the range of 0.5 - 1.5 J/cm2 for all…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…of automobile engine fuel injection nozzles and engine cooling plates; hole drilling and structuring of biomedical filters; cutting and drilling of FR-4 resin; cutting and drilling of both lowtemperature co-fired ceramics and high-temperature cofired ceramics; and microprocessing of metals such as…