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Fr4

Microelectronics

Microelectronics

…head. The position of the holes, as well as the shape, must fulfill very tight tolerances (50 µm diameter vias in resin-coated copper (RCC), Fr4 and aramid-based dielectrics, as well as Cu-direct drilling processes. The AVIA-series diode-pumped UV lasers are ideal for drilling <70 µm diameter…

Untitled-2

Untitled-2

…typically accounts for a little more than half this total. In volume production, multiple SiP devices are fabricated on a single substrate, typically FR4 or ceramics, which is then cut singulated to yield individual devices. Furthermore, in some cases, trenches are cut into the molding compound in…

USP Lasers Semiconductor Packaging Whitepaper.pdf

USP Lasers Semiconductor Packaging Whitepaper.pdf

…typically accounts for a little more than half this total. In volume production, multiple SiP devices are fabricated on a single substrate, typically FR4 or ceramics, which is then cut singulated to yield individual devices. Furthermore, in some cases, trenches are cut into the molding compound in…

Whitepaper - USP Lasers Deliver Cleaner Cuts for Semiconductor Packaging.pdf

Whitepaper - USP Lasers Deliver Cleaner Cuts for Semiconductor Packaging.pdf

…typically accounts for a little more than half this total. In volume production, multiple SiP devices are fabricated on a single substrate, typically FR4 or ceramics, which is then cut singulated to yield individual devices. Furthermore, in some cases, trenches are cut into the molding compound in…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…of automobile engine fuel injection nozzles and engine cooling plates; hole drilling and structuring of biomedical filters; cutting and drilling of FR-4 resin; cutting and drilling of both lowtemperature co-fired ceramics and high-temperature cofired ceramics; and microprocessing of metals such as…

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