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Fr4 Cutting

USP Lasers Semiconductor Packaging Whitepaper.pdf

USP Lasers Semiconductor Packaging Whitepaper.pdf

…In volume production, multiple SiP devices are fabricated on a single substrate, typically FR4 or ceramics, which is then cut singulated to yield individual devices. Furthermore, in some cases, trenches are cut into the molding compound in individual devices (before singulation) all the way down to…

Whitepaper - USP Lasers Deliver Cleaner Cuts for Semiconductor Packaging.pdf

Whitepaper - USP Lasers Deliver Cleaner Cuts for Semiconductor Packaging.pdf

…In volume production, multiple SiP devices are fabricated on a single substrate, typically FR4 or ceramics, which is then cut singulated to yield individual devices. Furthermore, in some cases, trenches are cut into the molding compound in individual devices (before singulation) all the way down to…

Untitled-2

Untitled-2

…In volume production, multiple SiP devices are fabricated on a single substrate, typically FR4 or ceramics, which is then cut singulated to yield individual devices. Furthermore, in some cases, trenches are cut into the molding compound in individual devices (before singulation) all the way down to…

Microelectronics

Microelectronics

…down time. Related Products IndyStar Excimer Laser ExciStar Paladin Compact 355 Sapphire LP/LPX Sapphire Lasers Ion Lasers Si Wafer Scribing, Cutting and Dicing Coherent lasers are used in a large number of advanced silicon wafer applications, both in high-volume production and in the development…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…applications. These include LED dicing; sapphire cutting; drilling of automobile engine fuel injection nozzles and engine cooling plates; hole drilling and structuring of biomedical filters; cutting and drilling of FR-4 resin; cutting and drilling of both lowtemperature co-fired ceramics…

COHR AILU CO Lasers 08-18.pdf

COHR AILU CO Lasers 08-18.pdf

…with the shorter
wavelength CO laser.
The most common polymers used for PCBs
are FR4, a fiberglass and epoxy composite.
The CO laser wavelength is well absorbed by
FR4, enabling high efficiency drilling. Use of the
CO laser with other materials depends upon

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