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1 - 5 of 5 Products for 'Fr4 Cutting' Page 1 of 1 |
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Related Categories: K-225i | Stealth Dicing

Fr4 Cutting

Lasers-Enable-Smartphone-Manufacturing.pdf

Lasers-Enable-Smartphone-Manufacturing.pdf

…225W at a wavelength of 9.4 µm. This wavelength is particularly useful since a large number of commonly used PCB substrate materials, including FR4, resin-coated foil (RCC), polyimides, PTFE, and aramids (Thermount), exhibit substantially higher absorption at this wavelength than at the more common…

Lasers-Enable-Smartphone-Manufacturing.pdf

Lasers-Enable-Smartphone-Manufacturing.pdf

…225W at a wavelength of 9.4 µm. This wavelength is particularly useful since a large number of commonly used PCB substrate materials, including FR4, resin-coated foil (RCC), polyimides, PTFE, and aramids (Thermount), exhibit substantially higher absorption at this wavelength than at the more common…

Laser-Enable-Smartphone.pdf

Laser-Enable-Smartphone.pdf

…225W at a wavelength of 9.4 µm. This wavelength is particularly useful since a large number of commonly used PCB substrate materials, including FR4, resin-coated foil (RCC), polyimides, PTFE, and aramids (Thermount), exhibit substantially higher absorption at this wavelength than at the more common…

Lasers-Enable-Smartphone-Manufacturing.pdf

Lasers-Enable-Smartphone-Manufacturing.pdf

…225W at a wavelength of 9.4 µm. This wavelength is particularly useful since a large number of commonly used PCB substrate materials, including FR4, resin-coated foil (RCC), polyimides, PTFE, and aramids (Thermount), exhibit substantially higher absorption at this wavelength than at the more common…

Lasers-Enable-Smartphone.pdf

Lasers-Enable-Smartphone.pdf

…225W at a wavelength of 9.4 µm. This wavelength is particularly useful since a large number of commonly used PCB substrate materials, including FR4, resin-coated foil (RCC), polyimides, PTFE, and aramids (Thermount), exhibit substantially higher absorption at this wavelength than at the more common…

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