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Fr4 Cutting

Lasers-Enable-Smartphone-Manufacturing.pdf

Lasers-Enable-Smartphone-Manufacturing.pdf

…225W at a wavelength of 9.4 µm. This wavelength is particularly useful since a large number of commonly used PCB substrate materials, including FR4, resin-coated foil (RCC), polyimides, PTFE, and aramids (Thermount), exhibit substantially higher absorption at this wavelength than at the more common…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…applications. These include LED dicing; sapphire cutting; drilling of automobile engine fuel injection nozzles and engine cooling plates; hole drilling and structuring of biomedical filters; cutting and drilling of FR-4 resin; cutting and drilling of both lowtemperature co-fired ceramics…

Lasers-Enable-Smartphone-Manufacturing.pdf

Lasers-Enable-Smartphone-Manufacturing.pdf

…225W at a wavelength of 9.4 µm. This wavelength is particularly useful since a large number of commonly used PCB substrate materials, including FR4, resin-coated foil (RCC), polyimides, PTFE, and aramids (Thermount), exhibit substantially higher absorption at this wavelength than at the more common…

Lasers-Enable-Smartphone-Manufacturing.pdf

Lasers-Enable-Smartphone-Manufacturing.pdf

…225W at a wavelength of 9.4 µm. This wavelength is particularly useful since a large number of commonly used PCB substrate materials, including FR4, resin-coated foil (RCC), polyimides, PTFE, and aramids (Thermount), exhibit substantially higher absorption at this wavelength than at the more common…

Lasers-Enable-Smartphone-Manufacturing.pdf

Lasers-Enable-Smartphone-Manufacturing.pdf

…225W at a wavelength of 9.4 µm. This wavelength is particularly useful since a large number of commonly used PCB substrate materials, including FR4, resin-coated foil (RCC), polyimides, PTFE, and aramids (Thermount), exhibit substantially higher absorption at this wavelength than at the more common…

Lasers-Enable-Smartphone-Manufacturing.pdf

Lasers-Enable-Smartphone-Manufacturing.pdf

…225W at a wavelength of 9.4 µm. This wavelength is particularly useful since a large number of commonly used PCB substrate materials, including FR4, resin-coated foil (RCC), polyimides, PTFE, and aramids (Thermount), exhibit substantially higher absorption at this wavelength than at the more common…

Lasers-Enable-Smartphone-Manufacturing.pdf

Lasers-Enable-Smartphone-Manufacturing.pdf

…225W at a wavelength of 9.4 µm. This wavelength is particularly useful since a large number of commonly used PCB substrate materials, including FR4, resin-coated foil (RCC), polyimides, PTFE, and aramids (Thermount), exhibit substantially higher absorption at this wavelength than at the more common…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…applications. These include LED dicing; sapphire cutting; drilling of automobile engine fuel injection nozzles and engine cooling plates; hole drilling and structuring of biomedical filters; cutting and drilling of FR-4 resin; cutting and drilling of both lowtemperature co-fired ceramics…

USP Lasers Semiconductor Packaging Whitepaper.pdf

USP Lasers Semiconductor Packaging Whitepaper.pdf

…In volume production, multiple SiP devices are fabricated on a single substrate, typically FR4 or ceramics, which is then cut singulated to yield individual devices. Furthermore, in some cases, trenches are cut into the molding compound in individual devices (before singulation) all the way down to…

USP Lasers Semiconductor Packaging Whitepaper.pdf

USP Lasers Semiconductor Packaging Whitepaper.pdf

…over IR because the longer wavelength can cause burning or charring in many of the composite substrates (e.g. FR4) commonly utilized. And while UV lasers actually delivers a higher quality cut than green lasers, the only commercial USP lasers with UV output currently available offer lower powers and…

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