…of Lasers in Manufacturing LIM 2013 in Physics Procedia and is published courtesy of Elsevier Ltd. Large-area laser lift-off processing in microelectronics Schematic layout of a line beam optical system for wafer LLO 308 nm LLO removal of 70 µm thin silicon wafer from glass carrier GaN surface…
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Bulk GaN substrate wafer manufacturing is difficult, and not applicable to commercial LED
production. Instead, GaN layers are heteroepitaxially grown on dissimilar substrate materials
…of laser lift-off after the GaN layer
has been grown and has been bonded to a
metal-type wafer as illustrated in figure6.
With suitable process management the
separated sapphire wafers are reusable as
GaN growth wafers.
Separating the sapphire wafer from the
…organic thin films, fine patterning of pixel and touchscreen structures, excimer laser annealing (ELA) for surface modification, excimer laser lift-off (LLO) for substrate separation, welding, and marking. Excimer lasers are at the forefront of mobile display innovations in the LCD and OLED segments…
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