…Marking Lasers are used to permanently mark an almost endless list of materials. Laser marking can provide a permanent high-contrast mark on different types of plastics, allowing no direct contact with the plastic other than through the laser beam. A variety of results can be achieved when marking…
…Metal cutting option available Datasheet META 2C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Glass Cutting & Drilling Marking Brazing Cutting Drilling ABS Acrylic Wood and Derivatives Ceramic Plastic --> Features & Benefits META 2C Processing…
…5 ExciStar 1000 1000 10 Datasheet ExciStar Applications Application Process Material Diamond and Eye Glass Marking Laser Vision Correction Rapid Protoyping Wire Stripping Engraving Diamond Glass Plastic --> Features & Benefits ExciStar Key Feature Customer Benefit Ultra-Compact Low investment…
…Metal cutting option available Datasheet META 1.5C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Etch Barrier Patterning Marking Cutting Drilling Engraving Wood and Derivatives Acrylic ABS Ceramic --> Features & Benefits META 1.5C Processing Capabilities:…
…Application Process Material Choose an Application Glass Cutting & Drilling OPA Pumping fs Micromachining Precise Metal Marking & Cutting Thin-film Ablation Wafer Scribing Display Cutting Drilling Scribing Marking Surface Modification Glass Polymer Ceramic Thin Film Stainless Steel --> Features…
--> HyperRapid NX and NXT Series This industrial picosecond laser series is designed and manufactured for 24/7 operation in a variety of environmental conditions. High average power operation at >100 W across a wide range of repetition rates up to 4 MHz, allows for high throughput micro-machining…
--> PowerLine C Versatile Laser Sub-System for Glass and Organic Materials Processing CO 2 laser-based sub-system for precision drilling, cutting, scribing, marking and engraving of a wide range of materials PowerLine C is a CO 2 laser-based sub-system that offers an unmatched combination of…
…Applications Application Process Material Materials Processing Cutting Dicing/Scribing Drilling Engraving Marking Repair Stereolithography Thin Film Patterning Trimming Ceramic FPD Glass Metal Polymer Sapphire ABS Solar Cell/Panel Flexible PCB Photopolymer Mould Hard Disk Indent card LCD Medical…
…lasers Drawing Avia LX w/o handle Applications Application Process Material Materials Processing Drilling Engraving Scribing Cutting Marking Flexible PCB Glass Thin Film Ceramic Silicon Metal --> Features & Benefits AVIA LX Key Advantages:
* Integrated laser head – eliminates separate controller…
…Scientific Life Sciences Materials Processing Microelectronics 3D Contour Mapping Bio-Medical Research Dicing/Scribing Marking Atom Molecule Fluorescence Excitation Ceramic FPD Glass Metal Polymer Sapphire Solar Cell/Panel Plastic Silicon Electronics Hard Disk Indent card LCD Medical Device Mask…
…working chamber
* Easy operation due to graphical user interface Options
* Rotation axis with up to 40 rev/min and positioning accuracy 0,05°
* Marking field 180 x 180 mm
* Camera viewing systems for process optimization
* Exhaust unit including remote start and control
* Automatic door The…
…converting, marking, engraving, cutting, perforating and drilling. The long wave infrared output of these CO2 lasers makes them compatible with numerous organic materials, including paper, cardboard, plastic films, textiles, leather, wood, plastics, and carbon composites, as well as glass and even…