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1 - 12 of 28 Products for 'Glass Micromachining' Page 1 of 3 |

Glass Micromachining

Monaco femtosecond laser

Monaco femtosecond laser

…Application Process Material Choose an Application Glass Cutting & Drilling OPA Pumping fs Micromachining Precise Metal Marking & Cutting Thin-film Ablation Wafer Scribing Display Cutting Drilling Scribing Marking Surface Modification Glass Polymer Ceramic Thin Film Stainless Steel --> Features…

Microelectronics

Microelectronics

…dielectrics and copper. Related Products AVIA NX HyperRapid NX Micromachining with Industrial Lasers Excimer and fiber lasers enable industrial micromachining. Ultraviolet (UV) laser light is an ideal tool for many micromachining applications. The short wavelength results in two major advantages:…

AVIA NX nanosecond laser

AVIA NX nanosecond laser

…PCBs, drilling vias, scribing photovoltaics or micromachining metals, AVIA NX lasers are better than ever and better than the competition. Datasheet AVIA NX Green Datasheet AVIA NX Ultraviolet Applications Application µ-via drilling Glass Cutting & Drilling Thin-film Scribing Ceramic Processing…

DIAMOND J-3-5 CO Laser - 5µm

DIAMOND J-3-5 CO Laser - 5µm

…Applications A new generation of carbon monoxide (CO) lasers from Coherent, promise enhanced processing characteristics in applications ranging from glass, ceramic and film cutting and drilling, through medical and aesthetics fractional skin resurfacing. Contact Us About This Product Close PRICE…

High-energy ultrafast ytterbium amplifier

High-energy ultrafast ytterbium amplifier

…Watch the video to learn more! > Watch the video to learn more! Datasheet Monaco HE Applications Application fs Micromachining Multidimensional Spectroscopy THz Spectroscopy OPA Pumping Glass Cutting & Drilling Time Resolved Luminescence and Spectroscopy --> Ultrafast Ytterbium Amplifier - Monaco HE…

HyperRapid NX/NXT - Industrial Picosecond Laser

HyperRapid NX/NXT - Industrial Picosecond Laser

…at >100 W across a wide range of repetition rates up to 4 MHz, allows for high throughput micro-machining with the highest quality and no heat affected zone. The HyperRapid NXT model enables micromachining applications, cutting LCP, FCP and OLED films and foils, drilling FPCB, and ablation and…

HYPER RAPID Lasers

HYPER RAPID Lasers

micromachining. The newest member of this industrial ultrafast laser family, the HYPER RAPID 100 is the first ever to offer pulse-on-demand and burst mode operation in a 100W laser system, enabling a whole range of new processes for machining brittle materials such as ceramics, sapphire and glass.

Femtosecond Lasers

Femtosecond Lasers

…lasers are suitable for ultra-fine processing of materials with little or no heat affected zone (HAZ). Target materials for these lasers include glass, OLED, IC packages/wafers, and flexible thin films. In science, these lasers address the requirements of optogenetics, multi-photon microscopy, and…

HELIOS

HELIOS

…the low cost of ownership solution in micromachining and microelectronics applications. Contact Us About This Product Close PRICE HERE Actively Q-Switched DPSS Laser The actively Q-switched Helios laser allows for better precision in a variety of micromachining and microelectronics applications.…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…layers of glass. The topmost
(outer) sheet is often a 700-µm-thick protective cover glass. To minimize the risk
of scratching and breakage, this outer
layer of the topmost glass is chemically
treated to produce a very tough surface
-- Corning's Gorilla Glass, Asahi's

RAPID-FX-Data-Sheet-06-17-15.pdf

RAPID-FX-Data-Sheet-06-17-15.pdf

…68 cm x 26 cm x 29 cm contains all electronics; external chiller required RAPID FX Applications: · Percussion drilling of small apertures for injector nozzles in metal · High precision machining of medical parts · Low-k scribing · Micromachining of glass and sapphire parts www.Coherent.com/RAPID_FX

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…Abstract: Thin glass (< 100 microns) is a promising material from which advanced interposers for high density electrical
interconnects for 2.5D chip packaging can be produced. But thin glass is extremely brittle, so mechanical micromachining
to create through glass vias (TGVs) is…