…Pico 10-532 IC).
resist layers and metal coatings make it important
that the laser does not cause delamination. Here, the
circular gold pad has been converted to black without
delamination. In the next image, an IC substrate…
An IC itself consists of numerous electronic components constructed on a single,
monolithic semiconductor wafer. The detailed structure of these devices is built up
layer by layer in a process called photolithography, with the first step being to coat
…larger than a typical IC
chip and needs correspondingly higher laser
power to complete the lift-off in an economically practical time.
In flexible display production, a glass panel
that serves as temporary carrier for handling
purposes is first coated with a polymer film.…
drilling. Vias are the
small holes in circuit
electrical connections between layers in integrated circuit (IC) substrates
and printed circuit
From the outset, laser drilling offered a particularly
…building are greatly improved.
The problem for glass manufacturers
is that the transparent conductive oxide materials that form the low-e coating cannot withstand the temperatures
required for tempering, a process performed for safety reasons. Tempering
involves heating glass and…
…Virtually all types of advanced packages,
such as flip chip, wafer-level chip scale
packages, fan out wafer-level packaging,
embedded IC, and 2.5D/3D, require redistribution layers (RDL). These are defined
by the addition of metal and dielectric layers onto the surface of the…
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