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Ito Ablation

LLO WavelengthAdvantage.pdf

LLO WavelengthAdvantage.pdf

…rate, as listed in the table below. Thin silicon device wafers separation LLO of thin silicon device wafers from their glass carriers is done by ablating the polymer layer through the glass wafer. After laser lift-off, the glass wafer can be easily removed from the silicon wafer, as shown in the…

COHR WhitePaper High Repetition Rate USP Lasers Improve OLED Cutting Results.pdf

COHR WhitePaper High Repetition Rate USP Lasers Improve OLED Cutting Results.pdf

…materials with high precision and minimal heat affected zone. This paper reviews application results showing that for sensitive materials with a low ablation threshold, increasing laser repetition rate can increase process throughput and improve quality simultaneously. By Florent Thibault, Product…