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Laser Cleaving

COHR UMCs 780-830nm DS 0517 1.pdf

COHR UMCs 780-830nm DS 0517 1.pdf

Unmounted Diode Laser Chips, 780 nm to 830 nm Datasheet
SPECIFICATIONS1,2,3,4 100 m emitter width
3W 100m x 2mm 3.5W 100m x 2mm
Optical Output Power (W) 3 3.5
Emitter Width (µm) 100 100
Chip Width (µm) 500 500
Cavity Length (mm) 2 2
Shipping/Delivery Configuration…

Photonics Spectra - March 2018

Photonics Spectra - March 2018

…Until recently, all commercial versions
of this cutting technique have utilized
picosecond lasers. Several display manufacturers now make extensive use of these
systems, which can cleave virtually any
glass type at speeds up to 2 m/s and glass
thicknesses up to 10 mm.

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