laser that is already widely employed for semiconductor package cutting. Coherent also offers
higher power AVIA NX lasers than this (up to 50W), and these can deliver higher cutting speeds due
to this additional power. However, there is trade-off in terms of speed versus cut quality…
require that any cutting method deliver 24/7 reliability, with high throughput and a yield above
99.9%. Laser cutting has emerged as the only method for flexible OLED trimming that can meet
all these requirements.
To implement laser cutting, the laser beam is directed through…
…laser cut glass can typically
withstand two to three times as much force as mechanically cut glass.
Figure 1. Comparison of mechanically cut (left) and laser cut (right) glass. The mechanically cut glass shows
significant residual stress, and substantial debris from the cutting…
…mechanical glass cutting can lead to microcracks and debris.
Laser glass cutting, based on CO
nanosecond solid-state lasers, has been
in use for some time in the display industry. Both of these lasers produce dramatically better results than mechanical cutting, but can…
…connecter The Status connector is an interface on the back of the power
supply, that can be used to output the present state of the laser
system (laser diodes, shutter, interlock).
The Status connector is an 8-pin female circular connector
(also called DIN-connector, refer to DIN…
…stress in the glass. The result is a
better quality cut, stronger glass, and a
wider cut process window.
The CO laser also enables radial (freeform) glass cutting; in contrast, CO
lasers can only produce straight line cuts
because the inherently round output
CO2 SLAB LASER CUTTING AND WELDING WITHOUT BREAK ROFIN FL SERIES DC SERIES
…the glass. The result is a better-quality cut, stronger glass, and a wider cut process window (FIGURE). Another important advantage is that the CO laser enables radial (free-form) glass cutting. In contrast, CO 2 lasers can only produce straight-line cuts because the inherently round output beam…
…production: Laser Lift-Off (LLO) to separate the finished LED from the sapphire growth wafer Laser Induced Forward Transfer (LIFT) to move the LED from a donor to the substrate Excimer Laser Annealing (ELA) to fabricate a LTPS-TFT backplane Laser cutting at different levels of aggregation Laser…
…Another common surgical application
of cutting close to, but sparing, sensitive tissue structures (such as nerves) was
also explored. For this study, a vessel was
embedded deeper in the tissue phantom.
Again, the laser was able to cut precisely and cleanly close to the vessel…
August 2016 www.laserfocusworld.com Laser Focus World
thus came to dominate flow cytometry
in the 1980s. Over time, however, the
ongoing evolution of highly reliable and
compact air-cooled argon lasers enabled
construction of smaller (though still…