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Laser Cutting

Coherent-new-lasers-improve-glass-cutting-methods wp.pdf

Coherent-new-lasers-improve-glass-cutting-methods wp.pdf

laser. In particular, the CO laser can
cut strengthened glass and so now provides an alternative process to filamentation methods.
The relative effectiveness of the two laser types for cutting non-strengthened glasses has also
been investigated independently in detail by the Laser

Higher Power Nanosecond Lasers Cut Thicker Films, PCBs, and Flex Substrates

Higher Power Nanosecond Lasers Cut Thicker Films, PCBs, and Flex Substrates

…Services (310) 377-5393 davidkuntz@cox.net For Immediate Release: New Ultrafast Laser Broadens Horizons for Multiphoton Imaging Santa Clara, CA, 10/19/2019 - The unique performance of the new Chameleon Discovery NX laser delivers deep multiphoton microscope images with superb brightness and high…

Whitepaper - USP Lasers Deliver Cleaner Cuts for Semiconductor Packaging.pdf

Whitepaper - USP Lasers Deliver Cleaner Cuts for Semiconductor Packaging.pdf


laser that is already widely employed for semiconductor package cutting. Coherent also offers
higher power AVIA NX lasers than this (up to 50W), and these can deliver higher cutting speeds due
to this additional power. However, there is trade-off in terms of speed versus cut quality…

COHR WhitePaper High Repetition Rate USP Lasers Improve OLED Cutting Results.pdf

COHR WhitePaper High Repetition Rate USP Lasers Improve OLED Cutting Results.pdf


require that any cutting method deliver 24/7 reliability, with high throughput and a yield above
99.9%. Laser cutting has emerged as the only method for flexible OLED trimming that can meet
all these requirements.
To implement laser cutting, the laser beam is directed through…

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

laser cut glass can typically
withstand two to three times as much force as mechanically cut glass.
Figure 1. Comparison of mechanically cut (left) and laser cut (right) glass. The mechanically cut glass shows
significant residual stress, and substantial debris from the cutting

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…mechanical glass cutting can lead to microcracks and debris.
Laser glass cutting, based on CO
2
and
nanosecond solid-state lasers, has been
in use for some time in the display industry. Both of these lasers produce dramatically better results than mechanical cutting, but can…

Picosecond laser

Picosecond laser

…connecter The Status connector is an interface on the back of the power
supply, that can be used to output the present state of the laser
system (laser diodes, shutter, interlock).
The Status connector is an 8-pin female circular connector
(also called DIN-connector, refer to DIN…

Laser Focus World - June 2015

Laser Focus World - June 2015

…stress in the glass. The result is a
better quality cut, stronger glass, and a
wider cut process window.
The CO laser also enables radial (freeform) glass cutting; in contrast, CO
2
lasers can only produce straight line cuts
because the inherently round output
beam…

Industrial Laser Solutions - May/June 2015

Industrial Laser Solutions - May/June 2015

…the glass. The result is a better-quality cut, stronger glass, and a wider cut process window (FIGURE). Another important advantage is that the CO laser enables radial (free-form) glass cutting. In contrast, CO 2 lasers can only produce straight-line cuts because the inherently round output beam…

DC Series 03-2017 E.pdf

DC Series 03-2017 E.pdf

CO2 SLAB LASER CUTTING AND WELDING WITHOUT BREAK ROFIN FL SERIES DC SERIES

Laser Focus World - August 2017

Laser Focus World - August 2017

…Another common surgical application
of cutting close to, but sparing, sensitive tissue structures (such as nerves) was
also explored. For this study, a vessel was
embedded deeper in the tissue phantom.
Again, the laser was able to cut precisely and cleanly close to the vessel…

Microsoft Word - Coherent Whitepaper - Laser Processing of µLED

Microsoft Word - Coherent Whitepaper - Laser Processing of µLED

…production: Laser Lift-Off (LLO) to separate the finished LED from the sapphire growth wafer Laser Induced Forward Transfer (LIFT) to move the LED from a donor to the substrate Excimer Laser Annealing (ELA) to fabricate a LTPS-TFT backplane Laser cutting at different levels of aggregation Laser