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Laser Debonding

COHR COMPexSeries DS 1219 2.pdf

COHR COMPexSeries DS 1219 2.pdf

…at large field size · Unrivalled pulse stability of 0.75%, rms to ensure high fluence control · Ultimate pulse control and system parameter logging to deliver smart and reproducible thin films APPLICATIONS · PLD - Pulsed Laser Deposition · Thin Wafer Processing · Laser Lift-Off/Debonding · LA-ICP-MS

COHR ExcimerCatalog2020 final lr.pdf

COHR ExcimerCatalog2020 final lr.pdf

…rms to ensure high fluence control
· Ultimate pulse control and system
parameter logging to deliver smart
and reproducible thin films
APPLICATIONS
· PLD - Pulsed Laser Deposition
· Thin Wafer Processing
· Laser Lift-Off/Debonding
· LA-ICP-MS
COMPex

Photonik Feb2014.pdf

Photonik Feb2014.pdf

…3: Polyimide coated display
glass after laser lift-off separation
ers in using temporary glass
carriers and laser lift-off
release because there is no
need for investing in new
production equipment.
Laser debonding
of thin wafers
The increasing functional…

Microsoft Word - Coherent Whitepaper - Laser Processing of µLED

Microsoft Word - Coherent Whitepaper - Laser Processing of µLED

…allows transfers of up to 1000 dies in parallel with a single laser
shot.
sapphire
carrier
substrate with active matrix
attach temporary carrier
transfer dies to substrate
pitch
die size
de-bond sapphire wafer
RGB Epi Wafer with µLED µLED dies

COHR COMPexSeries DS 0618 8.pdf

COHR COMPexSeries DS 0618 8.pdf

…at large field size · Unrivalled pulse stability of 0.75%, rms to ensure high fluence control · Ultimate pulse control and system parameter logging to deliver smart and reproducible thin films APPLICATIONS · PLD - Pulsed Laser Deposition · Thin Wafer Processing · Laser Lift-Off/Debonding · LA-ICP-MS

COHR PowerLine AVIANX DS 0519.pdf

COHR PowerLine AVIANX DS 0519.pdf

…enables high-speed processing · Extended UV lifetime ensures low operating costs · Configurable with many optional features APPLICATIONS · PCB Cutting · IC Package Cutting · Flex-PCB Cutting and Drilling · Laser Lift-Off (LLO) · System-in-Package Cutting · Scribing and Trenching · Wafer De-Bonding

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

…numerous opportunities for lasers because of their unique ability to perform diverse materials processing tasks with high precision and minimal heat affected zone (HAZ). As a result, laser use is increasing in wafer dicing, package singulation, optical debonding, µ-via drilling, RDL (redistribution…

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

…Selective Debonding with Excimer Lasers
The laser debonding process is conducted with a 308
nm excimer laser. UV lasers work via a cold process
very much different from infrared lasers.
IR lasers penetrate far into the adhesive layer and
easily cause debonding through a…

EU Photonics Flexible Displays.pdf

EU Photonics Flexible Displays.pdf

…UV laser technology
unite to the perfect carrier separation
tool. Excimer lasers uniquely provide
the necessary pulse energies and optical
performance characteristics to support
square centimeter scale processing areas with optimum beam geometry for
fast debonding of…

COHR ExcimerCatalog2019.pdf

COHR ExcimerCatalog2019.pdf

…rms to ensure high fluence control
· Ultimate pulse control and system
parameter logging to deliver smart
and reproducible thin films
APPLICATIONS
· PLD - Pulsed Laser Deposition
· Thin Wafer Processing
· Laser Lift-Off/Debonding
· LA-ICP-MS
COMPex

COHR COLasersDebonding WP 0220.pdf

COHR COLasersDebonding WP 0220.pdf

FEB/MAR 2020 15 INDUSTRIAL LASER APPLICATIONS CHINA APPLICATION REPORT CO CO2 CO CO 40µm PCB CO CO2 10.6µm 5~6µm CO PCB HAZ CO2 70~80µm CO CO CO Lasers Benefit Via Drilling And Wafer Debonding Peter Rosenthal Coherent Dirk Müller Coherent George Oulundsen Coherent 5~6 µmCO PCB CO PCB PCB PCB PCB CO2…