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Laser Dicing

COHR HELIOS DS 0217 3.pdf

COHR HELIOS DS 0217 3.pdf

…identical form, fit, function allowing the user for an easy and quick wavelength change. HELIOS lasers are the right economic choice for surface-near applications like thin-film processing, scribing, dicing, and marking. FEATURES · Pulse-width: 600 ps to 900 ps · High output power - Up to 6W at 1064…

Microelectronics

Microelectronics

…building lasers for these very demanding applications, which require ultra-high precision and no unscheduled down time. Related Products IndyStar Excimer Laser ExciStar Paladin Compact 355 Sapphire LP/LPX Sapphire Lasers Ion Lasers Si Wafer Scribing, Cutting and Dicing Coherent lasers are used in…

Photonics Spectra - July 2017

Photonics Spectra - July 2017

…with less
excitation.
A semiconductor laser, in this case for a VCSEL (vertical-cavity surface-emitting laser), being loaded into an
automated bonding machine as part of the production process.
Microscopic inspection of VCSEL dice for quality control.
Philips Photonics

ULTRAFAST LASERS Free-Space CPA Approach Uses Volume Holographic Gratings.pdf

ULTRAFAST LASERS Free-Space CPA Approach Uses Volume Holographic Gratings.pdf

…ultrafast lasers also enables medical device manufacturing such as the creation of
polymeric bioresorbable cardiovascular stents.
Ultrafast lasers also find wide use in semiconductor and microelectronic manufacturing
applications. For example, they are used in the dicing of thin…

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

lasers because of their unique ability to perform diverse materials processing tasks with high precision and minimal heat affected zone (HAZ). As a result, laser use is increasing in wafer dicing, package singulation, optical debonding, µ-via drilling, RDL (redistribution layer) structuring, dicing

Helios Whitepaper2014.pdf

Helios Whitepaper2014.pdf

…marking glass and sapphire, Helios lasers
can also be used for cutting and scribing these and
other brittle and/or delicate materials, such as silicon,
which are difficult to machine using traditional
mechanical methods. For example, when dicing silicon
wafers used in…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf


nanosecond laser for laser grooving, but
now we've switched to a 1064-nm picosecond laser and perform stealth dicing. This has delivered several benefits.
First, the picosecond laser produces a
much smaller heat-affected zone than
the nanosecond laser," Zhao explained.

RAPID NX Laser

RAPID NX Laser

lasers at a lower power level and entry price. The system is designed for demanding specialty marking, engraving and LED dicing applications. The included intuitive software controls all laser functions via internal embedded processor. An optional DLL allows the user to control the laser via an…

RAPID-NX-Data-Sheet-06-23-14.pdf

RAPID-NX-Data-Sheet-06-23-14.pdf

…of Coherent's picosecond laser lineup, the RAPID NX is a next generation picosecond laser system that encompasses all features of the existing RAPIDseries at a significantly reduced cost of ownership.Thus, the RAPID NX is ideally suited for sophisticated marking, LED dicing, thin film removal, and…

HELIOS

HELIOS

…Linear Jitter (between sequential pulses, gating mode) < ±2 ns Jitter (trigger to laser pulse, single pulse triggering) < ±2 ns < ±5 ns < ±2 ns < ±5 ns Laser Assembly Type Type A Type B Type A Type B Laser Head Size(W x H x L) 128 x 177 x 270 mm (5 x 7 x 10.6 in) 128 x 104 x 257 mm (5 x 4.1…

Photonics Spectra - September 2016

Photonics Spectra - September 2016

…to as
excimer laser annealing (ELA).
In ELA, the excimer output beam is reshaped into a long narrow line profile. The
length of the line ideally matches either the
half or full width of the panel; hundreds of
smartphone displays are eventually diced
from each panel.…

Monaco femtosecond laser

Monaco femtosecond laser

…such mobile device manufacturing, laser glass cutting, OLED display processing, wafer dicing, and thin film cutting, just to name a few. Contact Us About This Product Close PRICE HERE Diode-Pumped Femtosecond Industrial Laser The Monaco ultrashort pulse laser provides 60 W of IR, 30 W of green,…