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Laser Lift Off Uv

UV Processing Solutions

UV Processing Solutions

…backplanes on large substrate panels with the highest yield. UV Optical Components UV Optical Components A wide range of UV Optical Components to make the most of your UV laser beam. UVblade UVblade UVblade excimer laser is used for Laser Lift-Off and is available at line beam lengths supporting…

LAMBDA SX Excimer Laser Series

LAMBDA SX Excimer Laser Series

…LAMBDA SX lasers are perfectly suited for applications ranging from microstructuring, advanced semiconductor packaging, manufacturing of high-temperature superconductors by Pulsed Laser Deposition (PLD), Laser Lift-Off (LLO) to high power UV LIDAR. The E-Series is ideal for Excimer Laser Annealing…

EU LASER Interview R Waldermann Goettingen German.pdf

EU LASER Interview R Waldermann Goettingen German.pdf

…gefordert mit einer
UV Leistung von 3,6 kW.
LASER: Neben der ELA-Anwendung in
der Display-Massenproduktion gibt es
weitere Anwendungen der Excimerlaser...
Waldermann: Als weitere Anwendung
im Bereich modernster Bildschirmtechnik ist das Laser Lift-Off (LLO) zu

UVblade Excimer Laser

UVblade Excimer Laser

…substrates and wafers. Datasheet UVblade Applications Application Laser Lift-Off --> Features & Benefits UV blade Model UV blade 250 UV blade 380 UV blade 465 UV blade 750 UV blade 1000 Wavelength (nm) 308 308 308 308 308 Laser Pulse Energy (mJ) 580 580 1000 1000/2000 (high power model) 2000…

Excimer Lasers

Excimer Lasers

…excimer laser series provides unique UV power to the production floor. It is used for applications ranging from microstructuring, advanced semiconductor packaging, Pulsed Laser Deposition Laser Lift-Off (LLO) to high power UV LIDAR. LEAP Excimer Laser LEAP Excimer Laser LEAP excimer lasers deliver a…

VarioLas UV material processing

VarioLas UV material processing

--> VarioLas VarioLas UV material processing systems, based on the COMPexPro 100 Excimer laser series are affordable tools for high-quality UV microprocessing. Superior optics design, rugged mechanics, and unmatched pulse-to-pulse stability are the key ingredients to each of the VarioLas systems,…

PowerLine AVIA NX UV Laser Sub-System for micromachining applications

PowerLine AVIA NX UV Laser Sub-System for micromachining applications

…AVIA NX High-power UV Laser Sub-System for High Throughput Wafer, PCB and IC Package Cutting Powerful UV laser solution for Microelectronics and other ultraprecision manufacturing environments The Coherent PowerLine AVIA NX combines a 40 Watt, solid-state, ultraviolet (UV) laser and precision scan…

COMPex excimer laser

COMPex excimer laser

--> COMPex The Excimer Laser – Market Leading UV-Technology COMPex lasers are highly efficient light sources, featuring a compact design and easy installation and operation. They deliver superior results in demanding applications, such as solid sampling systems (LA-ICPMS), material research (PLD),…

Microelectronics

Microelectronics

…substrate. The high energy UV photons interact with the metal/substrate interface, directly removing the thin metal film in a pattern defined by the mask image. With a metal film thickness of 40 nanometers or less, a single laser pulse can perform a complete lift with clean edges and no breaks…

Materials Processing & Industrial Applications

Materials Processing & Industrial Applications

…lines for grinding paper. Related Products AVIA NX DC Series DIAMOND C-Series DIAMOND E-Series DIAMOND J-Series PerfoLite Laser Machines and Systems Laser Lift Off In flexible display manufacturing, transistors fabricated on a thin polymer/glass substrate must be detached from the substrate…

Preinstallation Manual Paladin Advanced Mode Locked UV Laser System

Preinstallation Manual Paladin Advanced Mode Locked UV Laser System

…different chiller models below will be sent with the
system.
8/10 W uses P302-17227.
16/24/35 W uses P307-16273.
1. Lift the top cover off the chiller crate (see Figure 3-4). Do not
turn the chiller upside down while you remove it from the
crate.
NOTICE!
The…

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

…backside processing, the laser initiated detachment
occurs at the glass/adhesive interface. After laser
debonding, the glass substrate is lifted off the thinned
wafer, leaving some residual adhesive which is then
removed using solvents.
The Excimer Laser Advantage
The…