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Laser Scribing

Laser Focus World - June 2015

Laser Focus World - June 2015


is then used to produce a thermal shock
which creates a scribe line in the glass. For
thicker glass substrates, this is followed by
mechanical breaking. The overall process
is the same with the CO laser; however,
the glass absorption of the 5 µm output
is much…

Industrial Laser Solutions - May/June 2015

Industrial Laser Solutions - May/June 2015

…water jet cooling is then used to produce a thermal shock, which creates a scribe line in the glass. For thicker glass substrates, this is followed by mechanical breaking. The overall process is the same with the CO laser; however, glass absorption of the 5µm output is much lower. Thus, the light…

COHR AILU CO Lasers 08-18.pdf

COHR AILU CO Lasers 08-18.pdf

…CO laser beam has a larger depth of focus than the CO2 laser. This yields higher fluence over a longer distance along the optical axis, which increases the thickness of the substrate that the laser can scribe. Figure 2: 40 µm width, 300 µm deep scribe in 0.64 mm thick fired ceramic. Scribe has…

CO Lasers from Lab to Fab

CO Lasers from Lab to Fab

…wavelength spreads more slowly scribe Residual stress from CO 2 laser cutting process Defect free break from CO laser cutting process Fig. 1 Scribing with a CO 2 laser leaves some residual stress after the glass is mechanically broken, while CO laser scribing produces virtually none. over distance,…

x lase A4 4s 02 2013 lr 1 .pdf

x lase A4 4s 02 2013 lr 1 .pdf

INDUSTRIAL PICOSECOND FIBER LASERS X-LASE SERIES LOW-K GROOVING AI ON PET ABLATION SAPPHIRE SCRIBING GLASS-GLASSWELDING GLASS-METAL-GLASSWELDING Rofin Group company

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

Ahead the New Glass Cutting COHR Rofin Whitepaper.pdf

…other limitation of topside scribing using an ultrafast laser is a taper always remains on the scribe or
hole, usually in the 8° to 12° range.
Within ultrafast lasers, cut quality using a femtosecond laser has proven to be superior to a picosecond
laser, although usually at a reduced…

COHR PowerLine AVIANX DS 0519.pdf

COHR PowerLine AVIANX DS 0519.pdf

PowerLine AVIA NX Datasheet
MICROELECTRONICS CUTTING AND TRENCHING
Cross-section of laser-cut PCB Cutting edge of PCB Scribing lines in molding compound

COH Bro Packaging US DIN A4 2018-05-03 web.pdf

COH Bro Packaging US DIN A4 2018-05-03 web.pdf

…makes life easier
The modern customer expects more
than just nice printing! Lasers are the
key technology for smart packaging
with an added value. Laser scribed
easy-to-open lines and laser perforated monolayer films for enhanced shelf
life of perishable fresh food are…

USP Lasers Semiconductor Packaging Whitepaper.pdf

USP Lasers Semiconductor Packaging Whitepaper.pdf

…thick polyimide sheets scribed with a nanosecond and USP laser (in the UV). The
nanosecond laser processed at 66 mm/sec, while the USP laser cut at 193 mm/sec. The nanosecond laser produced
a substantial HAZ - seen as a darkening in this image - while the USP laser produced none, and also…

COHR PowerLinePico50 DS 1019.pdf

COHR PowerLinePico50 DS 1019.pdf

…1064 nm or 532 nm · Integrated laser positioning help · External modulator for ultra-precise pulse control · Water/Air-cooled laser · Low operating costs APPLICATIONS · Plastic Marking · Plastic Foil/Tape Cutting · Thin Film Ablation · Removal of Plastic Coatings · Laser Scribing · Surface Cleaning

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

…thickness of the ceramic and the desired diameter, both USP and CO lasers are
excellent choices for via drilling in LTCC.
Figure 3: Cross section of 0.6mm thick scribed LTCC. The comparison shows the CO laser's
scribe penetrating further and generating higher aspect ratio holes due to…

COHR WhitePaper High Repetition Rate USP Lasers Improve OLED Cutting Results.pdf

COHR WhitePaper High Repetition Rate USP Lasers Improve OLED Cutting Results.pdf

…HAZ of USP laser processing delivers a unique advantage. Even nanosecond pulsewidth
lasers with ultraviolet (UV) output, which are widely employed in challenging applications
throughout microelectronics manufacturing (e.g., for high precision wafer cutting, scribing and
marking),…