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Led Scribe

Microelectronics

Microelectronics

…concepts such as laser-lift-off (LLO) processing with 193 nm and 248 nm excimer lasers enable vertical LED structures with increased light extraction efficiency. Laser-based sapphire scribing, as well as wafer or substrate dicing with diode-pumped solid-state lasers at 266 nm and 355 nm or…

34706a cover.indd

34706a cover.indd

…and Interconnect (API) applications. With dimension roadmaps showing a decade
of dimension shrink on PCBs, interconnects, Silicon & LED scribe widths and wafer thickness, we
believe that our portfolio of lasers aligns well with these demands as well as new processes that seem

32311a coverSinglesRR.indd

32311a coverSinglesRR.indd

…and Interconnect (API) applications. With dimension roadmaps showing a decade
of dimension shrink on PCBs, interconnects, Silicon & LED scribe widths and wafer thickness, we
believe that our portfolio of lasers aligns well with these demands as well as new processes that seem

Coherent

Coherent


Interconnect (API) applications. With dimension roadmaps showing a decade of dimension shrink on
PCBs, interconnects, Silicon & LED scribe widths and wafer thickness, we believe that our portfolio of
lasers aligns well with these demands as well as new processes that seem likely…

an rep 2018 workfile 02

an rep 2018 workfile 02

…and Interconnect (API) applications. With dimension roadmaps showing a decade
of dimension shrink on PCBs, interconnects, Silicon & LED scribe widths and wafer thickness, we
believe that our portfolio of lasers aligns well with these demands as well as new processes that could

COHR HELIOS DS 0217 3.pdf

COHR HELIOS DS 0217 3.pdf

…at 532 nm · Repetition rate from single-shot up to 125 kHz · Exact pulse control · High beam quality: TEM00/M2 <1.25 · Excellent pointing stability APPLICATIONS · Thin-Film Scribing · LED Dicing · Marking, Engraving - Ceramics, Glass, Sapphire, Diamond · Repair - Displays, Memories, etc. HELIOS

COHR MATRIX355 DS 0317 2.pdf

COHR MATRIX355 DS 0317 2.pdf

…over thousands of hours APPLICATIONS · Marking of Complex Plastic Structures · Laser Trimming of Embedded Passives with Diode-Pumped Solid-State Lasers · Inside Glass Marking · Laser Direct Patterning · LED Package Marking · Solar P1 to P3 · Thin-film Scribing · Rapid Prototyping MATRIX 355

COHR MATRIX355 DS 1118 1.pdf

COHR MATRIX355 DS 1118 1.pdf

…operation over thousands of hours APPLICATIONS · Marking of Complex Plastic Structures · Laser Trimming of Embedded Passives with Diode-Pumped Solid-State Lasers · Inside Glass Marking · Laser Direct Patterning · LED Package Marking · Solar P1 to P3 · Thin-film Scribing · Rapid Prototyping

Helios Whitepaper2014.pdf

Helios Whitepaper2014.pdf

…marking the sapphire wafers used as
substrates in the production of high brightness LEDs.
These marks are typically lot numbers and other
identifying information placed on the sapphire after LED
structures have been created, i.e., after a significant
amount of cost has been…

CO Lasers from Lab to Fab

CO Lasers from Lab to Fab

…The traditional mechanical glass
cutting method involves making an initiation scribe (a limited depth cut), followed by mechanical breaking to separate the scribed pieces. Unfortunately,
this initiation scribe produces cracks
which tend to propagate (randomly) on
their own due to…

COHR AILU CO Lasers 08-18.pdf

COHR AILU CO Lasers 08-18.pdf

…distance along the
optical axis, which increases the thickness of the substrate that the laser can scribe.
Figure 2: 40 µm width, 300 µm deep scribe in 0.64 mm thick fired ceramic. Scribe has an aspect
ratio of >8:1 (depth/diameter), which is twice what can be achieved with CO2,…

x lase A4 4s 02 2013 lr 1 .pdf

x lase A4 4s 02 2013 lr 1 .pdf

…pump lasers: Water
OPTIONS
· Microspot optics
· Autofocusing
· Burst mode
APPLICATIONS
GLASS SCRIBING GLASS-METAL-GLASSWELDING SAPPHIRE SCRIBING GLASS-GLASSWELDING
OPTIONS
· Focused beam output
· Autofocusing
· Burst mode
APPLICATIONS

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