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Matrix Uv

COHR MATRIXaccessories DS 1118 2.pdf

COHR MATRIXaccessories DS 1118 2.pdf

Coherent MATRIX Accessories Datasheet
90° Cable Adapter
Part Number: 1143342
520.6 mm
(20.5 in.)
71 mm
(2.8 in.)
130 mm
(5.12 in.)
60.87 mm
(2.4 in.)
Side View
Bottom View
MATRIX UV MATRIX UV and IR/GREEN MATRIX IR/GREEN
Kinematic…

COHR MaterialsProcessingBrochure 0816revA 3.pdf

COHR MaterialsProcessingBrochure 0816revA 3.pdf

…of processes such
deposited on top of the part and the next laser processing step begins.
SLA typically uses a low power UV wavelength like from a MATRIX UV
laser to selectively harden a photosensitive epoxy polymer in a bath
to form a part. SLM builds up a part from polymer or…

COHR ExcimerCatalog2019.pdf

COHR ExcimerCatalog2019.pdf

Superior Reliability & Performance
8
Applications Matrix
Applications Matrix Excimer Lasers and UV Optical Systems
ExciStar IndyStar COMPex LEAP LAMBDA SX VYPER
Marking
Polymer, Teflon Marking · · ·
Visible and Invisible Marking (Eyeglass Marking, etc.) · · ·…

EU LASER Interview R Waldermann Goettingen German.pdf

EU LASER Interview R Waldermann Goettingen German.pdf

…mit 370 mm Linienlänge in
Kombination mit einem 300
W Excimerlaser erfordert, heute sind 1600
mm Linienlänge gefordert mit einer
UV Leistung von 3,6 kW.
LASER: Neben der ELA-Anwendung in
der Display-Massenproduktion gibt es
weitere Anwendungen der Excimerlaser...…

Industrial Laser Solutions - January / February 2014

Industrial Laser Solutions - January / February 2014

Melted material Heated area Reinforcement fbers Vaporized material IR laser beam UV laser beam Matrix resin Removed material Removed material Heat affected zone Microcracks 18 Industrial Laser Solutions JANUARY/FEBRUARY 2014 www.industrial-lasers.com t e c h n o l o g y r e p o r t Laser cleaning…

EU CMM Luebeck Luger Interview 0918.pdf

EU CMM Luebeck Luger Interview 0918.pdf


marking process does not affect
the performance or properties
of the device. Non-contact laser
marking, using UV DPSSLs such
as those in our Matrix series, is
widely utilised for this purpose.
At the other end of semiconductor
production is packaging, and the…

CMM 9.3.indd

CMM 9.3.indd


In summary, UV laser marking is shown to be a
superior solution applicable to medical devices,
disposables, pharmaceutical, and associated related
packaging. The advent of DPSS lasers optimised
for these marking applications now also makes UV
marking economically…

SST 2017-09 Laser Marking.pdf

SST 2017-09 Laser Marking.pdf

…data
matrix codes.
The thin green
solder resist
layer on top of
the substrate
has to carry the
mark, and care
has to be taken
that the copper
underneath the
solder resist is
not exposed.
Moreover, data
matrix codes can be…

ExcimerCFRPCleaning.pdf

ExcimerCFRPCleaning.pdf

…and of the CFRP matrix material. For a moderate laser energy density of 600 mJ/cm2 at the CFRP surface, the thickness of the ablated layer can be carefully adjusted via the number of applied laser pulses. Based on the need, only the release agent layer or also the adjacent matrix material can be…

CMM 11.5.indd

CMM 11.5.indd

…cross-sections is a viable solution.
To this end, the processed microLED epi wafer may be bonded to a
temporary carrier wafer by means of
a UV absorbing polymer adhesive
film. Illumination with excimer laser
wavelengths of 248 nm or 308
nm will vaporise the adhesive and…

EU Photonics Flexible Displays.pdf

EU Photonics Flexible Displays.pdf

…across the entire carrier with
smallest beam overlap and hence a minimum number of UV pulses per carrier.
Pulse-on-demand - saving laser
pulses in practice
Laser pulses and those in the UV spectral region in particular come at a cost.
These costs are associated with the

Excimer LLO 2014.pdf

Excimer LLO 2014.pdf

…on glass panels must be delaminated to create thin, lightweight, and rugged flexible-display backplanes. Low-thermal-budget lift-off processing with UV lasers protects the adjacent functional layers. When it comes to large Gen 4.5-Gen 8 substrate panels, which have to be released from polymer thin…