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1 - 12 of 34 Products for 'Micro Drilling' Page 1 of 3 |

Micro Drilling

HYPER RAPID Lasers

HYPER RAPID Lasers

…HR 50 Mechanical Drawing Drawing HR 100 Mechanical Drawing Applications Application Process Material Glass Cutting & Drilling Ink-Jet Nozzle Drilling TCO Structuring µ-via drilling Printing & Embossing Tools Printing 3D Contour Mapping Glass Ceramic Sapphire --> Features & Benefits
* 50W/100W at…

KLS

KLS

--> KLS As a result of the outstanding beam quality and the high pulse power, the KLS laser series can be used in particular for fine cutting, drilling, scribing, and precision welding as well as for multiple applications. With the modular structure, 6 different designs are available. Contact Us…

HyperRapid NX/NXT - Industrial Picosecond Laser

HyperRapid NX/NXT - Industrial Picosecond Laser

…quality and no heat affected zone. The HyperRapid NXT model enables micromachining applications, cutting LCP, FCP and OLED films and foils, drilling FPCB, and ablation and SmartCleave-based cutting of brittle materials. Contact Us About This Product Close PRICE HERE The New Generation of High…

Picosecond Lasers

Picosecond Lasers

…the best mix of high-quality results and reasonable process throughput for a wide range of precision processing applications, including cutting, drilling, and marking. All Picosecond Lasers Products HELIOS HELIOS The actively Q-switched Helios lasers are offered in IR and Green. Delivering pulse…

MATRIX Family of Q-Switch Lasers

MATRIX Family of Q-Switch Lasers

…noise and MATRIX specific pulse control concept
* Excellent beam parameters: - Fine and micro processing capabilities/micrometer precision - Reduced danger of work piece damage (dicing saws, scribers, drills) - No tool ware necessary - Cost savings - Easier handling - Increase in flexibility -…

StarShape 100/250 C/P

StarShape 100/250 C/P

--> StarShape 100/250 C/P The Coherent StarShape 100/250 C/P integrates a CO 2 laser providing an extensive range for micro material processing like free contour shaping, text or surface structuring of polymers, glass paper or natural materials such as leather, vulcanized rubber or wood. Contact Us…

Specialty Laser Systems

Specialty Laser Systems

…PowerLine C PowerLine C is a CO2 laser-based sub-system that offers an unmatched combination of convenience, versatility and economy for precision drilling, cutting, scribing, structuring, marking and engraving of a wide range of materials. StarPack AP StarPack AP The StarPack AP combines all the…

Ultrashort Pulse Lasers | Coherent

Ultrashort Pulse Lasers | Coherent

…the best mix of high-quality results and reasonable process throughput for a wide range of precision processing applications, including cutting, drilling, and marking. Material processing with femtosecond pulses in the range of 300 fs to 900 fs offers a small heat-affected zone (HAZ) and increased…

Microelectronics

Microelectronics

…(50 µm diameter vias in resin-coated copper (RCC), Fr4 and aramid-based dielectrics, as well as Cu-direct drilling processes. The AVIA-series diode-pumped UV lasers are ideal for drilling <70 µm diameter vias in RCC and PTFE-based dielectrics and copper. Related Products AVIA NX HyperRapid NX…

Flyer NA 2017 en.pdf

Flyer NA 2017 en.pdf

The NA 100 / 200 / 302 / 502 N lasers drill blind holes in eyeless needles for micro surgery with utmost precision. Precise drilling of blind holes in micro surgical needles with high aspect ratio. Compatible with most medical-grade steels. Designed for mass production in a 24/7 environment. Ultra…

COHR DIAMOND J-3-5 COlaser DS 0617 2.pdf

COHR DIAMOND J-3-5 COlaser DS 0617 2.pdf

…and CW operation · Beam focusability down to 25 µm · CO2 Laser-like low cost of ownership APPLICATIONS · Glass Processing · Film Cutting · Micro Via Drilling · Ceramic Processing · Metal Processing · Selective Laser Sintering · Surgical - Tissue Cutting and Cauterization · Aesthetics - Fractal Skin…

The PCB Magazine, November 2015

The PCB Magazine, November 2015

drilling in a very
different manner. Specifically, the pencil-shaped beam
As Vias Shrink, Opportunities for Laser Drilling Expand
article
Figure 2: Schematic illustrating the difference between the direct
write and mask-based writing technique for laser via drilling.