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Paladin Compact

COHR PaladinCompact355 DS 0318 3.pdf

COHR PaladinCompact355 DS 0318 3.pdf

Paladin Compact 355-2000/4000 Air-Cooled, Quasi-CW Modelocked UV Lasers Paladin Compact is an air-cooled, picosecond UV laser in a compact package for highly demanding OEM applications. The quasi-cw laser pulses with high output power stability at 120 MHz are beneficial for precise imaging…

Paladin CompactAir DSrevA.qxd

Paladin CompactAir DSrevA.qxd

System Specifications Wavelength (nm) 355
Output Power (W)
Paladin Compact 355-2000 Air-Cooled >2
Paladin Compact 355-4000 Air-Cooled >4
Repetition Rate (MHz) 120 ±2
Pulse Length (ps) >15 @ 1064 nm
Spatial Mode TEM00
M2 <1.2
Beam Waist Diameter…

PaladinAdvanced355 Datasheet 2017.pdf

PaladinAdvanced355 Datasheet 2017.pdf

…lifetime · Cleanroom-built and hermetically sealed for long-term reliability · Compact and modular laser design for easy integration · Smart power supply for complete hands-free operation · Highest efficiency APPLICATIONS · Materials Processing · Microelectronics Paladin Advanced 355

34706a cover.indd

34706a cover.indd

…delivering higher yields than traditional mechanical methods.
There are similar trends in chip packaging and PCB manufacturing requiring more compact
packaging and denser interconnects. In many cases, lasers present enabling technologies. For instance,
lasers are now the only…

EU CMM Luebeck Luger Interview 0918.pdf

EU CMM Luebeck Luger Interview 0918.pdf

…earliest steps in integrated
circuit fabrication is inspection of
un-patterned wafers to identify
contaminants. Our Azure and
Paladin lasers, which employ
different types of specialised UV
DPSS technology, are utilised
for this application as well as
for…

Coherent

Coherent

…operation and it is important for products used for inspection, measurement and testing to be reliable
and to have long lifetimes. Our Azure, Paladin and Excimer lasers are used to detect and characterize
defects in semiconductor chips.
Materials processing
Lasers are widely…

32311a coverSinglesRR.indd

32311a coverSinglesRR.indd

…delivering higher yields than traditional mechanical methods.
There are similar trends in chip packaging and PCB manufacturing requiring more compact
packaging and denser interconnects. In many cases, lasers present enabling technologies. For instance,
lasers are now the only…

PaladinAdvanced355 DS

PaladinAdvanced355 DS

Paladin Advanced 532 Mode Locked Laser Superior Reliability & Performance 246 mm (9.69 in.) 482 mm (18.98 in.) 89 mm (3.50 in.) 68 mm (2.68 in.) Optical fiber outlet Cable to Head; length: 4.8 m (15.75 ft.) 482.6 mm (19.0 in.) - 4 Hz Rackmount assembly (optional) Leave min. 10 mm (0.39 in.)…