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Pcb

AVIA NX Family of Compact DPSS Lasers

AVIA NX Family of Compact DPSS Lasers

…Green Datasheet AVIA NX Ultraviolet Applications Application µ-via drilling Glass Cutting & Drilling Thin-film Scribing Ceramic Processing Flex PCB drilling & cutting IC Package singulation Silicon Wafer scribing Fine metal machining --> Features & Benefits AVIA UV Product Evolution, an 18-year…

MATRIX QS DPSS Lasers

MATRIX QS DPSS Lasers

…Engraving Marking Repair Stereolithography Thin Film Patterning Trimming Ceramic FPD Glass Metal Polymer Sapphire wafer Solar Cell/Panel Flexible PCB Photopolymer Mould Hard Disk Indent card LCD Medical Device Plastic Memory Photopolymer ITO layers Quartz Resistor --> Features & Benefits Power…

AVIA LX

AVIA LX

…lasers Drawing Avia LX w/o handle Applications Application Process Material Materials Processing Drilling Engraving Scribing Cutting Marking Flexible PCB Glass Thin Film Ceramic Silicon Metal --> Features & Benefits AVIA LX Key Advantages:
* Integrated laser head – eliminates separate controller…

Microelectronics

Microelectronics

…display types and sizes Advanced Packaging and Interconnects (API) for back-end semiconductor manufacturing applications to printed circuit board (PCB) applications. Semiconductor Manufacturing for front-end semiconductor manufacturing processes, such as inspections. Micromachining for extreme…

The PCB Magazine, November 2015

The PCB Magazine, November 2015

November 2015 · The PCB Magazine 77 Dirk Müller, Ph.D. is director of marketing at coherent Inc. to reach the author, click here. AS VIAS SHrInK, oPPorTUnITIeS For LASer DrILLInG exPAnD ArTiCle response to this need, laser manufacturers have already developed a variety of tools to optimally support…

The PCB Magazine, November 2015

The PCB Magazine, November 2015

November 2015 · The PCB Magazine 77 Dirk Müller, Ph.D. is director of marketing at coherent Inc. to reach the author, click here. AS VIAS SHrInK, oPPorTUnITIeS For LASer DrILLInG exPAnD ArTiCle response to this need, laser manufacturers have already developed a variety of tools to optimally support…

The PCB Magazine, November 2015

The PCB Magazine, November 2015

November 2015 · The PCB Magazine 77 Dirk Müller, Ph.D. is director of marketing at coherent Inc. to reach the author, click here. AS VIAS SHrInK, oPPorTUnITIeS For LASer DrILLInG exPAnD ArTiCle response to this need, laser manufacturers have already developed a variety of tools to optimally support…

The PCB Magazine, November 2015

The PCB Magazine, November 2015

70 The PCB Magazine · November 2015 by Dirk Müller, Ph.D. coherent Inc. While lasers have long been employed for via drilling in PCB fabrication, mechanical drilling still remains the predominant production technology. However, as via diameters shrink to support various advanced packaging…

The PCB Magazine, November 2015

The PCB Magazine, November 2015

70 The PCB Magazine · November 2015 by Dirk Müller, Ph.D. coherent Inc. While lasers have long been employed for via drilling in PCB fabrication, mechanical drilling still remains the predominant production technology. However, as via diameters shrink to support various advanced packaging…

The PCB Magazine, November 2015

The PCB Magazine, November 2015

70 The PCB Magazine · November 2015 by Dirk Müller, Ph.D. coherent Inc. While lasers have long been employed for via drilling in PCB fabrication, mechanical drilling still remains the predominant production technology. However, as via diameters shrink to support various advanced packaging…

The PCB Magazine, November 2015

The PCB Magazine, November 2015

72 The PCB Magazine · November 2015 around the drilled hole, limiting how close it can be placed to other features. As a result, the practical lower limit on via diameters for CO2 lasers is about 70 µm. But what if the hole diameter needs to be smaller than 70 µm? Co Lasers This is where carbon…

The PCB Magazine, November 2015

The PCB Magazine, November 2015

74 The PCB Magazine · November 2015 UV Solid State Lasers In addition to CO2 lasers, diode-pumped solid-state (DPSS) lasers operating in the ultraviolet (UV) at 355 nm are a well-established source for drilling microvias, and are employed in other microelectronic fabrication tasks, such as wafer and…

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