…Green Datasheet AVIA NX Ultraviolet Applications Application µ-via drilling Glass Cutting & Drilling Thin-film Scribing Ceramic Processing Flex PCB drilling & cutting IC Package singulation Silicon Wafer scribing Fine metal machining --> Features & Benefits AVIA UV Product Evolution, an 18-year…
…operation. These characteristics make AVIA LX an ideal tool for high throughput, demanding, yet cost sensitive applications such as via drilling in PCB and flex materials, cutting of flex materials, 3D chip package manufacturing, IC package trimming, and wafer scribing. For the system builder, AVIA…
…Engraving Marking Repair Stereolithography Thin Film Patterning Trimming Ceramic FPD Glass Metal Polymer Sapphire wafer Solar Cell/Panel Flexible PCB Photopolymer Mould Hard Disk Indent card LCD Medical Device Plastic Memory Photopolymer ITO layers Quartz Resistor --> Features & Benefits Power…
…lasers Drawing Avia LX w/o handle Applications Application Process Material Materials Processing Drilling Engraving Scribing Cutting Marking Flexible PCB Glass Thin Film Ceramic Silicon Metal --> Features & Benefits AVIA LX Key Advantages:
* Integrated laser head – eliminates separate controller…
…Families Laser Machines and Systems Laser Direct Imaging Coherent lasers play a critical role in today’s advanced packaging and printed circuit board (PCB) applications, enabling smaller features, higher yield and higher throughput. As feature sizes on PCBs continue to shrink, traditional printing…
November 2015 · The PCB Magazine 77
Dirk Müller, Ph.D. is director
of marketing at Coherent Inc.
To reach the author, click here.
As Vias Shrink, Opportunities for Laser Drilling Expand
response to this need, laser manufacturers have
already developed a…
…spot size · Compact single box design for ease of integration · HALT-designed and HASS-verified to ensure quality and reliability APPLICATIONS · Polymer Cutting · Flex PCB Cutting · IC Package Cutting · Si Wafer Singulation · Medical Device Manufacturing · Thin Metal Foil Cutting and Texturing
…that the AVIA NX quality and reliability levels are beyond that of any other ns laser. AVIA NX is ideal for applications such as via drilling in PCB and Flex materials, 3D chip package manufacturing, IC package trimming, and wafer scribing. The AVIA NX offers effortless ease of integration into…
…wearables or portable devices. SiP devices consist of circuit components, such as a processor, memory, communication chip & sensors, on a PCB substrate which contains embedded copper traces. The entire assembly is typically encapsulated in molding compound, and an outer conductive coating…
your specic application
300mm lens, XYZ motion stage, vision system for
alignment and verification, SMEMA compatible
PCB handler, and edge-belt conveyor
Dual function; micro-machining & marking
Custom Class 1 system; pick `n place feeder system
different materials and laser types.
lasers have been employed extensively for PCB
high contrast features. However, they are rarely selected
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Risk factors: Except for the historical information contained here, many of the matters discussed in this Web site are forward-looking statements, based on expectations at the time they were made, that involve risks and uncertainties that could cause our results to differ materially from those expressed or implied by such statements. These risks are detailed in the “Factors That May Affect Future Results” section of our latest 10-K or 10-Q filing. Coherent assumes no obligation to update these forward-looking statements.