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1 - 12 of 18 Products for 'Pcb Cutting' Page 1 of 2 |

Pcb Cutting

AVIA NX nanosecond laser

AVIA NX nanosecond laser

…competition. Datasheet AVIA NX Green Datasheet AVIA NX Ultraviolet Applications Application µ-via drilling Glass Cutting & Drilling Thin-film Scribing Ceramic Processing Flex PCB drilling & cutting IC Package singulation Silicon Wafer scribing Fine metal machining --> Features & Benefits AVIA UV…

Microelectronics

Microelectronics

…down time. Related Products IndyStar Excimer Laser ExciStar Paladin Compact 355 Sapphire LP/LPX Sapphire Lasers Ion Lasers Si Wafer Scribing, Cutting and Dicing Coherent lasers are used in a large number of advanced silicon wafer applications, both in high-volume production and in the development…

AVIA LX 355-20 Laser

AVIA LX 355-20 Laser

…DPSS lasers Drawing Avia LX w/o handle Applications Application Process Material Materials Processing Drilling Engraving Scribing Cutting Marking Flexible PCB Glass Thin Film Ceramic Silicon Metal --> Features & Benefits AVIA LX Key Advantages:
* Integrated laser head – eliminates separate…

MATRIX Family of Q-Switch Lasers

MATRIX Family of Q-Switch Lasers

…Applications Application Process Material Materials Processing Cutting Dicing/Scribing Drilling Engraving Marking Repair Stereolithography Thin Film Patterning Trimming Ceramic FPD Glass Metal Polymer Sapphire ABS Solar Cell/Panel Flexible PCB Photopolymer Mould Hard Disk Indent card LCD Medical…

COHR Monaco517 DS 0318 4.pdf

COHR Monaco517 DS 0318 4.pdf

…spot size · Compact single box design for ease of integration · HALT-designed and HASS-verified to ensure quality and reliability APPLICATIONS · Polymer Cutting · Flex PCB Cutting · IC Package Cutting · Si Wafer Singulation · Medical Device Manufacturing · Thin Metal Foil Cutting and Texturing

COHR AVIA LX UV DS 0818 3.pdf

COHR AVIA LX UV DS 0818 3.pdf

…characteristics make AVIA LX an ideal tool for high throughput, demanding, yet cost sensitive applications such as via drilling in PCB and flex materials, cutting of flex materials, 3D chip package manufacturing, IC package trimming, and wafer scribing. For the system builder, AVIA LX offers…

AVIA LX Solid State Q-Switched UV Laser

AVIA LX Solid State Q-Switched UV Laser

…characteristics make AVIA LX an ideal tool for high throughput, demanding, yet cost sensitive applications such as via drilling in PCB and flex materials, cutting of flex materials, 3D chip package manufacturing, IC package trimming, and wafer scribing. For the system builder, AVIA LX offers…

an rep 2018 workfile 02

an rep 2018 workfile 02

…to be cut or structured. As film thicknesses decrease over time, lasers are becoming the
tool of choice to process these materials. Our DIAMOND CO2
and Rapid series ultrafast lasers are
used for cutting FPD films.
We have developed a proprietary technology for cutting of brittle…

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

…use is increasing in wafer dicing, package singulation, optical debonding, µ-via drilling, RDL (redistribution layer) structuring, dicing tape cutting (EMI shield), soldering, annealing and bonding, to name just a few. In this article, we review three quite different laser-based processes for this…

COHR AILU CO Lasers 08-18.pdf

COHR AILU CO Lasers 08-18.pdf


is a better quality scribe yielding a stronger cut
piece with higher bend strength, plus a wider
process window for the manufacturer.
The other advantage of CO lasers in glass
cutting is their ability to support the cutting
of curves. This benefits smartphone display…

Industrial Laser Solutions - May/June 2015

Industrial Laser Solutions - May/June 2015

…the glass. The result is a better-quality cut, stronger glass, and a wider cut process window (FIGURE). Another important advantage is that the CO laser enables radial (free-form) glass cutting. In contrast, CO 2 lasers can only produce straight-line cuts because the inherently round output beam…

COHR AVIA NX UV DS 0117 5.pdf

COHR AVIA NX UV DS 0117 5.pdf

…that the AVIA NX quality and reliability levels are beyond that of any other ns laser. AVIA NX is ideal for applications such as via drilling in PCB and Flex materials, 3D chip package manufacturing, IC package trimming, and wafer scribing. The AVIA NX offers effortless ease of integration into…

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Risk factors: Except for the historical information contained here, many of the matters discussed in this Web site are forward-looking statements, based on expectations at the time they were made, that involve risks and uncertainties that could cause our results to differ materially from those expressed or implied by such statements. These risks are detailed in the “Factors That May Affect Future Results” section of our latest 10-K or 10-Q filing. Coherent assumes no obligation to update these forward-looking statements.


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