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Polyimide

Excimer LLO 2014.pdf

Excimer LLO 2014.pdf

…the need to make major investments in entirely new production equipment [7]. Figure 6 depicts a Gen 4.5 glass carrier sample that had been coated with a 100 m polyimide (PI) film. After LLO at a 308 nm wavelength applying the line scan method, the Figure 4. System layout of a UV blade LLO system.

EU Photonics Flexible Displays.pdf

EU Photonics Flexible Displays.pdf

…reliability A number of rigid carrier separation techniques turn out to be unsuitable for mass production purposes. For examglass substrate spin-on polyimide +TFT array AMOLED + electrophoretic foil and driver foils laser lift-off freestanding flexible display Fig. 1 Schematics of flexible display…

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

…Excimer Laser Advantage The most important advantage of 308 nm excimer laser debonding over other techniques is that it enables utilization of polyimide based temporary adhesives which can withstand exposure to temperatures as high as 400°C. This enables the bonded assembly to successfully survive…

Photonik Feb2014.pdf

Photonik Feb2014.pdf

…nm. The smooth transition from rigid glass based displays to flexible polymer based displays is the main benefit for display manufacturFigure 3: Polyimide coated display glass after laser lift-off separation ers in using temporary glass carriers and laser lift-off release because there is no need…

CMM 10.4.indd

CMM 10.4.indd

…scribing and marking) cannot reach the required level of accuracy for this application (see figure 2). Figure 2: "Dark Yellow," 30 µm thick polyimide sheets scribed with a nanosecond and USP laser (in the UV). The nanosecond laser processed at 66 mm/sec, while the USP laser cut at 193 mm/sec.…

USP Lasers Semiconductor Packaging Whitepaper.pdf

USP Lasers Semiconductor Packaging Whitepaper.pdf

…Whitepaper September 20, 2017 www.coherent.com | tech.sales@coherent.com | 800-527-3786 | 408-764-4983 Figure 2. "Dark Yellow," 30 µm thick polyimide sheets scribed with a nanosecond and USP laser (in the UV). The nanosecond laser processed at 66 mm/sec, while the USP laser cut at 193 mm/sec.…

Excimer LLO 2014.pdf

Excimer LLO 2014.pdf

…the need to make major investments in entirely new production equipment [7]. Figure 6 depicts a Gen 4.5 glass carrier sample that had been coated with a 100 m polyimide (PI) film. After LLO at a 308 nm wavelength applying the line scan method, the Figure 4. System layout of a UV blade LLO system.

Excimer LLO 2014.pdf

Excimer LLO 2014.pdf

…the need to make major investments in entirely new production equipment [7]. Figure 6 depicts a Gen 4.5 glass carrier sample that had been coated with a 100 m polyimide (PI) film. After LLO at a 308 nm wavelength applying the line scan method, the Figure 4. System layout of a UV blade LLO system.

Thin-Wafer-Laser-Debonding-Fast-and-Without-Fuss.pdf

Thin-Wafer-Laser-Debonding-Fast-and-Without-Fuss.pdf

…Excimer Laser Advantage The most important advantage of 308 nm excimer laser debonding over other techniques is that it enables utilization of polyimide based temporary adhesives which can withstand exposure to temperatures as high as 400°C. This enables the bonded assembly to successfully survive…

Thin-Wafer-Laser-Debonding-Fast-and-Without-Fuss.pdf

Thin-Wafer-Laser-Debonding-Fast-and-Without-Fuss.pdf

…Excimer Laser Advantage The most important advantage of 308 nm excimer laser debonding over other techniques is that it enables utilization of polyimide based temporary adhesives which can withstand exposure to temperatures as high as 400°C. This enables the bonded assembly to successfully survive…

EU Photonics Flexible Displays.pdf

EU Photonics Flexible Displays.pdf

…reliability A number of rigid carrier separation techniques turn out to be unsuitable for mass production purposes. For examglass substrate spin-on polyimide +TFT array AMOLED + electrophoretic foil and driver foils laser lift-off freestanding flexible display Fig. 1 Schematics of flexible display…

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

…Excimer Laser Advantage The most important advantage of 308 nm excimer laser debonding over other techniques is that it enables utilization of polyimide based temporary adhesives which can withstand exposure to temperatures as high as 400°C. This enables the bonded assembly to successfully survive…

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