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Sapphire Scribing

Helios Whitepaper2014.pdf

Helios Whitepaper2014.pdf

…Figure 3: Picosecond lasers can be used to mark sapphire,
which is difficult to mark by other means due to its extreme
hardness.
In addition to marking glass and sapphire, Helios lasers
can also be used for cutting and scribing these and
other brittle and/or delicate…

X-LASE

X-LASE

…rates (up to 10 MHz) enable market leading processing speeds. For example X-LASE CoreScriber with CoreScribe™ process enables to increase sapphire scribing throughput at least by 50 % compared to any other method. X-LASE 24-6 Precise ablation with speed. X-LASE 24-6 is an industrial picosecond…

MATRIX Family of Q-Switch Lasers | Coherent

MATRIX Family of Q-Switch Lasers | Coherent

…Processing Cutting Dicing/Scribing Drilling Engraving Marking Repair Stereolithography Thin Film Patterning Trimming Ceramic FPD Glass Metal Polymer Sapphire wafer Solar Cell/Panel Flexible PCB Photopolymer Mould Hard Disk Indent card LCD Medical Device Plastic Memory Photopolymer ITO layers Quartz…

HELIOS

HELIOS

…Microelectronics 3D Contour Mapping Bio-Medical Research Dicing/Scribing Marking Atom Molecule Fluorescence Excitation Ceramic FPD Glass Metal Polymer Sapphire Solar Cell/Panel Plastic Silicon Electronics Hard Disk Indent card LCD Medical Device Mask Memory --> Features & Benefits
* Diode-pumped…

250 kHz Ultrafast Amplifiers

250 kHz Ultrafast Amplifiers

…ranging from 1 to 350 khz, with pulse energies ranging from a few uJ to over 45 mJ/pulse. QCW and Modelocked QCW and Modelocked Sapphire Lasers Sapphire Lasers Sapphire lasers feature outstanding performance and reliability, making them ideal for life science applications. Short-Pulse Lasers…

Microelectronics

Microelectronics

…precision and no unscheduled down time. Related Products IndyStar ExciStar Paladin Compact 355 Sapphire LP/LPX Related Product Families Sapphire Lasers Laser Machines and Systems Si Wafer Scribing, Cutting and Dicing Coherent lasers are used in a large number of advanced silicon wafer applications,…

x lase A4 4s 02 2013 lr 1 .pdf

x lase A4 4s 02 2013 lr 1 .pdf

INDUSTRIAL PICOSECOND FIBER LASERS X-LASE SERIES LOW-K GROOVING AI ON PET ABLATION SAPPHIRE SCRIBING GLASS-GLASSWELDING GLASS-METAL-GLASSWELDING Rofin Group company

COHR HRNX SmartCleave DS 0718 3.pdf

COHR HRNX SmartCleave DS 0718 3.pdf

…interfacing as standard HyperRapid NX to allow straightforward integration · Right of use to the Coherent SmartCleave IP is included APPLICATIONS · Cutting of strengthened and unstrengthened glass, sapphire, and ceramics · Scribing and drilling of glass, sapphire, ceramics, and composite materials

RAPID-FX-Data-Sheet-06-17-15.pdf

RAPID-FX-Data-Sheet-06-17-15.pdf

…68 cm x 26 cm x 29 cm contains all electronics; external chiller required RAPID FX Applications: · Percussion drilling of small apertures for injector nozzles in metal · High precision machining of medical parts · Low-k scribing · Micromachining of glass and sapphire parts www.Coherent.com/RAPID_FX

COHR HELIOS DS 0217 3.pdf

COHR HELIOS DS 0217 3.pdf

…at 532 nm · Repetition rate from single-shot up to 125 kHz · Exact pulse control · High beam quality: TEM00/M2 <1.25 · Excellent pointing stability APPLICATIONS · Thin-Film Scribing · LED Dicing · Marking, Engraving - Ceramics, Glass, Sapphire, Diamond · Repair - Displays, Memories, etc. HELIOS

34706a cover.indd

34706a cover.indd


sapphire and glass-cutting applications.
The trend for thinner and lighter devices is impacting the glass substrates used in today's mobile
devices requiring thinner glass with higher degrees of mechanical strength and scratch resistance. This
trend also includes use of sapphire

Coherent

Coherent


sapphire and glass-cutting applications.
The trend for thinner and lighter devices is impacting the glass substrates used in today's mobile
devices requiring thinner glass with higher degrees of mechanical strength and scratch resistance. This
trend also includes use of sapphire

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