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Si Cutting

Microelectronics

Microelectronics

…Related Products IndyStar ExciStar Paladin Compact 355 Sapphire LP/LPX Related Product Families Sapphire Lasers Laser Machines and Systems Si Wafer Scribing, Cutting and Dicing Coherent lasers are used in a large number of advanced silicon wafer applications, both in high-volume production and in…

COHR Monaco517 DS 0318 4.pdf

COHR Monaco517 DS 0318 4.pdf

…spot size · Compact single box design for ease of integration · HALT-designed and HASS-verified to ensure quality and reliability APPLICATIONS · Polymer Cutting · Flex PCB Cutting · IC Package Cutting · Si Wafer Singulation · Medical Device Manufacturing · Thin Metal Foil Cutting and Texturing

34706a cover.indd

34706a cover.indd

outsourced certain components, sub-assemblies and finished goods where we can maintain our high
quality standards while improving our cost structure.
As part of our strategy to increase our market share and customer support in Asia as well as our
continuing efforts to manage costs, we…

32311a coverSinglesRR.indd

32311a coverSinglesRR.indd

the acquisition of Lumera. In fiscal 2015, we increased our vertical integration capabilities with the
asset acquisition of the Tinsley Optics business from L-3 Communications Corporation.
We have designed and implemented proprietary manufacturing tools, equipment and techniques in
an…

Coherent

Coherent

As part of our strategy to increase our market share and customer support in Asia as well as our
continuing efforts to manage costs, we have transferred the production of additional products into both
the Singapore and Malaysia factories. In addition, we expanded our repair activities in…

ModeMaster PC User Manual

ModeMaster PC User Manual


ModeMaster PC were moved several meters in the external beam).
It is useful in such studies to know the physical width at the internal
cut planes corresponding to the window width across the full profile
display (between the ends of the trace). This is obtained by
converting…

ILS Annealing.PDF

…used for ICs are created through epitaxial growth to yield a virtually defect-free, single-crystal silicon boule. This boule is then physically cut to produce individual wafers for subsequent circuit fabrication. This method
isn't applicable to flat-panel display applications--rather, the…

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