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Silicon Carbide Dicing

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…(right). The picosecond laser produced a cleaner hole with less recast material and a smaller heat-affected zone (HAZ). Results of stealth dicing a silicon carbide wafer with a picosecond laser, before mechanical separation of the individual dies. Cross sections of glass cut with a nanosecond laser…

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