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Silicon Drilling

Industrial Photonics - April 2016

Industrial Photonics - April 2016


(Ultrafast)
CO
2
Excimer Fiber Direct Diode
Thin-Film Scribing
· · ·
Silicon Annealing
·
Cutting
· · · ·
Converting
· ·
Drilling
· · · · ·
Marking & Engraving
· · · · ·
Welding
· · ·
Cladding/Heat…

AVIA NX nanosecond laser

AVIA NX nanosecond laser

…Datasheet AVIA NX Green Datasheet AVIA NX Ultraviolet Applications Application µ-via drilling Glass Cutting & Drilling Thin-film Scribing Ceramic Processing Flex PCB drilling & cutting IC Package singulation Silicon Wafer scribing Fine metal machining --> Features & Benefits AVIA UV Product…

StarFiber 100-600 Fiber Laser for Fine Welding, Cutting, and Drilling

StarFiber 100-600 Fiber Laser for Fine Welding, Cutting, and Drilling

…100-600 Fiber Laser The StarFiber 100-600 fiber laser allows very small seam geometries at very high welding speeds. Laser fine cutting and drilling results in clean cuts with low heat affected zones and high edge qualities. Contact Us About This Product See Related Products Close PRICE HERE…

AVIA LX 355-20 Laser

AVIA LX 355-20 Laser

…DPSS lasers Drawing Avia LX w/o handle Applications Application Process Material Materials Processing Drilling Engraving Scribing Cutting Marking Flexible PCB Glass Thin Film Ceramic Silicon Metal --> Features & Benefits AVIA LX Key Advantages:
* Integrated laser head – eliminates separate…

Solar Cell Manufacturing

Solar Cell Manufacturing

…Wrap-Through schemes. Here conductive pathways (via’s) are drilled through c-Si cells to allow contacts to be located at the rear of the cells; busbars for MWT and both fingers/busbars for EWT. With a ten-year heritage in drilling Through Silicon Via’s (TSV’s) within the semiconductor industry, the…

Microelectronics

Microelectronics

…Scribing, Cutting and Dicing Coherent lasers are used in a large number of advanced silicon wafer applications, both in high-volume production and in the development of tomorrow’s advanced chip architectures. As silicon wafers get thinner and new material layers are added, lasers are playing a…

Coherent

Coherent

…enable market share gains in via drilling in silicon, flex circuit packaging and other
emerging applications. In addition, we launched a new CO2
laser platform called the Hornet, which
has specific performance and design attributes for the via drilling market, allowing integrators to…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…of drilling dense patterns of TGVs with
high hole counts. Based on mask illumination, this method supports parallel drilling of up over 1,000 through vias in 30
to 100 µm thin glass sheets. (We also briefly discuss that ultrafast lasers are an excellent alternative for laser drilling of…

32311a coverSinglesRR.indd

32311a coverSinglesRR.indd

Several display types require a high-density pattern of silicon thin film transistors (``TFTs''). If this
silicon is polycrystalline, the display performance is greatly enhanced. In the past, these polysilicon
layers could only be produced on expensive special glass at high temperatures.…

an rep 2018 workfile 02

an rep 2018 workfile 02

drilling, cutting, patterning, marking and yield
improvement.
Microelectronics--advanced packaging and interconnects
After a wafer is patterned, there are then a host of other processes, referred to as back-end
processing, which finally result in a packaged encapsulated silicon

COHR AVIA NX Green DS 0818 3.pdf

COHR AVIA NX Green DS 0818 3.pdf

…compact footprint · Simplified user interface at laser head · HALT designed/HASS certified · High reliability between long maintenance cycles APPLICATIONS · Drilling & Cutting PCBs · Micromaching Copper · Scribing & Grooving Silicon · Cutting and Machining Ceramics · Solar Cell Scribing

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…precision drill, scribe, cut or mark a material. Many traditional applications rely on infrared and visible Qswitched lasers, which have pulse widths in the tens of nanoseconds range, and which remove material via a photothermal interaction. Here, the focused laser beam For Glass and Silicon Wafer…