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Silicon Wafers

Laser Marking Systems

Laser Marking Systems

…efficient solution for marking parts in a production environment WaferLase ID silicon wafer marker WaferLase ID silicon wafer marker Waferlase ID systems are designed to meet the most stringent requirements of silicon wafer marking, assuring traceability ón the manufacturing process of semiconductor…

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

…backside processing of silicon wafers up to 300 mm diameter (Fig.3). Figure 3: Number of debonded thin wafers (Source: Yole Forecast) The processed thin wafers are then debonded from the glass carrier just prior to stacking. There are several techniques for performing thin wafer debonding, including…

SST 2017-09 Laser Marking.pdf

SST 2017-09 Laser Marking.pdf

…whenever deep marks into silicon are required,
such as placing wafer IDs near the wafer edge. Near
IR laser markers are also selected for marking molded
fan-out wafer level packaging wafers.
However, for marking either flip-chips or the backside
of wafers, green lasers are…

Photonics Spectra - March 2018

Photonics Spectra - March 2018

…latest
ytterbium fiber amplifiers make them ideal
for high-speed, cost-effective cutting of
plastic and polymer thin films, silicon
wafer scribing and strengthened glass
cutting. And because femtosecond laser
processing is usually highly nonlinear, it
is largely…

Microelectronics

Microelectronics

…number of advanced silicon wafer applications, both in high-volume production and in the development of tomorrow’s advanced chip architectures. As silicon wafers get thinner and new material layers are added, lasers are playing a critical role in processing these wafers. As wafers get thinner, they…

WaferLase ID Wafer Marking System

WaferLase ID Wafer Marking System

--> WaferLase ID silicon wafer marker Extreme Demands on Speed and Precision Contact Us About This Product Close PRICE HERE Waferlase ID systems are designed to meet the most stringent requirements of silicon wafer marking, assuring traceability ón the manufacturing process of semiconductor devices.…

AVIA NX nanosecond laser

AVIA NX nanosecond laser

…Application µ-via drilling Glass Cutting & Drilling Thin-film Scribing Ceramic Processing Flex PCB drilling & cutting IC Package singulation Silicon Wafer scribing Fine metal machining --> Features & Benefits AVIA UV Product Evolution, an 18-year learning curve
* Common Platform Across…

Company

…available laser. Today, Coherent is one of the world’s leading photonics manufacturers and innovators. With headquarters in the heart of Silicon Valley, California, and offices spanning the globe, Coherent offers a unique and distinct product portfolio that touches many different markets…

Photonik Feb2014.pdf

Photonik Feb2014.pdf

…application.
Reducing the wafer thickness is usually
achieved mechanically and via diverse etching methods, respectively.
According to the latest market survey, by the
year 2017 three quarters of all processed
silicon wafers will be thinned wafers with a
thickness of…

LLO WavelengthAdvantage.pdf

LLO WavelengthAdvantage.pdf

…in the table below. Thin silicon device wafers separation LLO of thin silicon device wafers from their glass carriers is done by ablating the polymer layer through the glass wafer. After laser lift-off, the glass wafer can be easily removed from the silicon wafer, as shown in the figure above.…

Helios Whitepaper2014.pdf

Helios Whitepaper2014.pdf

…as silicon,
which are difficult to machine using traditional
mechanical methods. For example, when dicing silicon
wafers used in semiconductor device fabrication, it is
especially essential that the cutting process doesn't
produce significant microcracks. Silicon scribing…

ULTRAFAST LASERS Free-Space CPA Approach Uses Volume Holographic Gratings.pdf

ULTRAFAST LASERS Free-Space CPA Approach Uses Volume Holographic Gratings.pdf

…also find wide use in semiconductor and microelectronic manufacturing
applications. For example, they are used in the dicing of thin silicon wafers that are so flexible
they become a challenge for traditional dicing machines. Flat-panel display and solar panel
manufacturing pose…