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Stealth Dicing

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…scribe part way
through the wafer, and the individual
chips are subsequently singulated mechanically. The second method is called
stealth dicing. Here the beam is focused
within the wafer itself, where it creates
a scribe within the material. Again, the
individual chips…