Talisker™ is a new family of high peak power and high average power picosecond lasers designed specifically for materials processing. Based on a scalable fiber laser platform Talisker is designed for an industrial environment and meets availability requirements of demanding industries. Delivering picosecond pulses these lasers minimize thermal damage and heat affected zone to enable smaller feature sizes for high precision micromachining. Minimizing thermal damage and heat affected zone enables a new range of high precision applications such as silicon machining, wafer dicing, solar cell manufacturing or glass scribing. Available at wavelengths of 1064 nm, 532 nm and 355 nm Talisker processes a wide variety of materials, including: silicon, polyimide, metals,”hard materials,” and glass.

Cold Machining - Processing with Greater Precision
Most processing industries today require smaller and more precise tolerances, dimensions and material thicknesses. Minimizing the heat transferred to the material during a production process is a key requirement. Picosecond, ultrashort laser pulses both limit the amount of heat diffusion into the target material and reduce the pulse energy and average power requirements. The unique capabilities of picosecond pulses are ideal for high quality micromachining, because they enable the smaller feature sizes required by the product roadmaps in a wide range of industries. Talisker is the new laser that provides this superior level of industrial precision. To get more information on the benefits of picosecond micromachining please download our whitepaper.

	Ready to develop new applications Talisker is designed for ease of use in an industrial environment. Software with a graphical user interface enables both smooth interface integration in machining tool designs and new applications development in an early project phase. The integrated AOM enables selection of pulses and custom pulse energy patterns. Harmonic versions of Talisker provide up to three output beams (1064 nm, 532 nm or 355 nm) from parallel beam exit ports enabling a fast track to the development of new applications. The power of a selected wavelength is software controllable and makes Talisker the most versatile tool to process and facilitate integration in versatile machine designs.
Clean sidewalls of Si via hole (SEM analysis)		Si wafer via hole drilling at 355 nm

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