…must fulfill very tight tolerances (50 µm diameter vias in resin-coated copper (RCC), Fr4 and aramid-based dielectrics, as well as Cu-direct drilling processes. The AVIA-series diode-pumped UV lasers are ideal for drilling <70 µm diameter vias in RCC and PTFE-based dielectrics and copper. Related…
it can produce blind vias using a simple,
three-pulse process. The first pulse drills
through the overlying copper, which has
a black oxide coating on it to make it absorb infrared (IR). The second pulse drills
through the glass resin board substrate material, which…
…silicon or glass.
Critical to the production of the interposer is
the creation of small through holes, called vias,
which are used to make electrical connections
between the circuit components. Target via
diameters are usually in the 25 µm size range.
These vias can be…
substrate wafers are well-suitable .
In a final step, the glass carrier is released
from the finished thin wafer via laser
lift-off. To this end, the excimer laser is
shown through the glass wafer and selectively evaporates the most adjacent fraction of polymer film.…
…The robot arm picks up the windscreen using vacuum
suction. Correct, adhesive-fixed installation requires correct orientation of the
glass in several axes and dimensions, e.g., tilt, rotation, XY, etc. The current
practice here is to project a small line across the gap between…
…tools are singulating PCBs, drilling vias, scribing photovoltaics or micromachining metals, AVIA NX lasers are better than ever and better than the competition. Datasheet AVIA NX Green Datasheet AVIA NX Ultraviolet Applications Application µ-via drilling Glass Cutting & Drilling Thin-film Scribing…
…Additionally, all interfaces to the laser are through the SoloBoard electronics board located in the Monaco head. We Bring the Cleanroom to You: The laser is built in a class 1000 cleanroom. The cleanliness, however, is maintained in the field via the PureFemtoTM active cleaning of the laser head.…
…2287-7525 53 Laser Drilling of High-Density Through Glass Vias (TGVs) for 2.5D and 3D Packaging Ralph Delmdahl and Rainer Paetzel Coherent Laser Systems GmbH & Co. KG (Received May 21, 2014: Corrected June 19, 2014: Accepted June 19, 2014) Abstract: Thin glass (500oC) · Optically transparent for…
glass. Currently, actual microelectronics production utilizes 2.5D packaging.
This is an intermediate step where just a
single set of circuit dies is stacked on the
A critical process is the creation of
small through holes (vias) which are
…that produced a fluence of 7J/cm2 at the work surface. The 193nm wavelength was chosen because glass exhibits strong absorption at this wavelength. FIGURE 1. Excimer laser (193nm) vias drilled into glass: The 25µm diameter entrance hole (a), the exit hole (b), and the cross-sectional view (c).
…of carbon monoxide (CO) lasers from Coherent, promise enhanced processing characteristics in applications ranging from glass, ceramic and film cutting and drilling, through medical and aesthetics fractional skin resurfacing. While CO lasers were first developed decades ago, practical limitations…
…process is conducted with a 308
nm excimer laser. UV lasers work via a cold process
very much different from infrared lasers.
IR lasers penetrate far into the adhesive layer and
easily cause debonding through a thermal mechanism
(e.g. heating). Oxide layers are put into the…
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