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Uv Homogenizer

EU LASER Interview R Waldermann Goettingen German.pdf

EU LASER Interview R Waldermann Goettingen German.pdf

…mit 370 mm Linienlänge in
Kombination mit einem 300
W Excimerlaser erfordert, heute sind 1600
mm Linienlänge gefordert mit einer
UV Leistung von 3,6 kW.
LASER: Neben der ELA-Anwendung in
der Display-Massenproduktion gibt es
weitere Anwendungen der Excimerlaser...…

COHR ExcimerCatalog2019.pdf

COHR ExcimerCatalog2019.pdf

Homogenizer 5x5 Homogenizer 10x10 Homogenizer 20x20
Homogenized Field Size (mm) 5 x 5 10 x 10 20 x 20
Zoom (%) ±10 ±10 ±10
Homogeneity (%) <±5 <±5 <±5
Field Position Entrance Aperture Entrance Aperture Entrance Aperture
Approx. 600 mm after Homogenizer Exit

Laser Focus World - November 2017

Laser Focus World - November 2017

…of this
application is based on considerable
advances in high-power excimer laser
technology and the UV optical system
that provides the line beam homogeneity required for uniform annealing of
ever-larger panels (see Fig. 4).
The processing capabilities of excimer…

Microsoft Word - Coherent Whitepaper - Laser Processing of µLED

Microsoft Word - Coherent Whitepaper - Laser Processing of µLED

…UVblade. The line
length (LA) is 52 mm and the width in the short axis (SA) is about 0.5 mm. The use of high grade
UV optical materials and beam homogenization in both axes gives high uniformity of <2% in the
flat-top beam area. Special attention has been spent on the exact shape…

Excimer LLO 2014.pdf

Excimer LLO 2014.pdf


aspect ratio of the line beam field is generated by independently shaping the two axes of the homogenized excimer
laser beam. The long-axis dimension is defined solely in
the homogenizer, which therefore includes a cylindrical
condenser lens in the beam path.
The short axis…

Case Study Excimer ELA 2018 English.pdf

Case Study Excimer ELA 2018 English.pdf

…of pulsed laser light at a wavelength of 308 nm
which moves along a glass carrier coated with amorphous silicon.
On account of the short UV wavelength and the
short laser pulse duration in the nanosecond
regime the energy of the line beam focus is
selectively applied to the…

Whitepaper Thin Wafer Laser Debonding.pdf

Whitepaper Thin Wafer Laser Debonding.pdf

…processing area on the work
piece, and to have a homogeneous intensity
distribution of ~1%, rms over its area.
Figure 6: COMPexPro excimer laser series
These requirements would be much more difficult to
achieve with other UV laser technologies, such as the
diode-pumped…

FutureElectronics June2014.pdf

FutureElectronics June2014.pdf

…absorbs the UV radiation. Remnant seeds of solid silicon
are the starting point for transforming the molten layer from amorphous
to polycrystalline silicon. (Fig.1). This
recrystallization process is known as
excimer laser annealing. On account
of the short UV wavelength and…

Photonik Feb2014.pdf

Photonik Feb2014.pdf

…in microelectronics at film thicknesses of some 10 to 100µm, the absorption depth of a UV laser is of the order of only 0.1µm. Hence, laser lift-off separation of the polymer remains at the short UV wavelength completely unnoticed by the performancedetermining functional layer. Microelectronics…

Excimer laser technology trends

Excimer laser technology trends

…technique to produce and control a homogeneous
gas discharge is crucial for the performance of a high power
excimer laser. Until 1998 preionization pins generated a
spark discharge some 10 ns before the main discharge. The
sparks produce UV radiation which is sufficient to…

COHR MaterialsProcessingBrochure 0816revA 3.pdf

COHR MaterialsProcessingBrochure 0816revA 3.pdf

…environments.The laser provides 40 µJ/pulse at 1 MHz to enable current and future throughput requirements in materials processing applications. Homogeneous materials such as glass
and metals, as well as processing of complex, layered-structures are readily addressed with
Monaco's sub-400…

ILS Annealing.PDF


the optimum crystal formation (in terms of resultant electronic
characteristics). The high absorption of the silicon also prevents the UV light from penetrating significantly into the glass
substrate below, thus avoiding any consequential heating of
the glass. This permits…