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Via Drilling

Microelectronics

Microelectronics

…must fulfill very tight tolerances (50 µm diameter vias in resin-coated copper (RCC), Fr4 and aramid-based dielectrics, as well as Cu-direct drilling processes. The AVIA-series diode-pumped UV lasers are ideal for drilling <70 µm diameter vias in RCC and PTFE-based dielectrics and copper. Related…

DIAMOND E-Series

DIAMOND E-Series

…converting, cutting, engraving, perforating and drilling of paper, plastic films, plastics, glass, carbon composites, textiles, wood and even thin metals. The RF power supply is detachable and a full suite of on-board diagnostics (accessible via the Internet) is available that allows for proactive…

Industrial Photonics - July 2018

Industrial Photonics - July 2018

…cause a loss of power. Even so, that may be
less of a problem in micromachining, since the amount
of material to be removed, marked, or drilled through is
typically microscopic.
The choice of wavelength involves balancing throughput and quality, Thibault said. The shorter UV…

HYPER RAPID Lasers

HYPER RAPID Lasers

…HR 50 Mechanical Drawing Drawing HR 100 Mechanical Drawing Applications Application Process Material Glass Cutting & Drilling Ink-Jet Nozzle Drilling TCO Structuring µ-via drilling Printing & Embossing Tools Printing 3D Contour Mapping Glass Ceramic Sapphire --> Features & Benefits
* 50W/100W at…

Laser Focus World - August 2016

Laser Focus World - August 2016

…boards (PCBs).
From the outset, laser drilling offered a particularly
attractive alternative for the production of blind vias
(that don't go through all layers in the circuit board) since these are difficult to produce using mechanical drills. In particular, the CO
2
laser…

AVIA NX nanosecond laser

AVIA NX nanosecond laser

…are singulating PCBs, drilling vias, scribing photovoltaics or micromachining metals, AVIA NX lasers are better than ever and better than the competition. Datasheet AVIA NX Green Datasheet AVIA NX Ultraviolet Applications Application µ-via drilling Glass Cutting & Drilling Thin-film Scribing Ceramic…

PowerLine AVIA NX UV Laser Sub-System for micromachining applications

PowerLine AVIA NX UV Laser Sub-System for micromachining applications

…development. Once in service, all system parameters can be easily varied and optimized for a specific task by the user via its Window 10 IoT based software. Datasheet PowerLine AVIA NX Applications Application Wafer Scribing Laser Lift-Off Flex PCB drilling & cutting IC Package singulation -->

LAMBDA SX Excimer Laser Series

LAMBDA SX Excimer Laser Series

…Power (W) LAMBDA SX C600 308 600 1000 600 LAMBDA SX E500 500 1000 500 Datasheet LAMBDA SX Applications Application Process Material Ink-Jet Nozzle Drilling 3D-Structuring Roll-To-Roll Circuit Patterning Pulsed Laser Deposition Automotive Cylinder Hardening Excimer Laser Annealing Sequential Lateral…

Monaco femtosecond laser

Monaco femtosecond laser

…Applications Application Process Material Choose an Application Glass Cutting & Drilling OPA Pumping fs Micromachining Precise Metal Marking & Cutting Thin-film Ablation Wafer Scribing Display Cutting Drilling Scribing Marking Surface Modification Glass Polymer Ceramic Thin Film Stainless Steel…

LabMax-Pro SSIM

LabMax-Pro SSIM

…traces of modulated lasers in the tens of microseconds or longer, commonly found in many thermal material processing applications such as cutting, drilling, and engraving Two new high-speed sampling modes enable control and monitoring of modulated and long-pulse lasers in ways that have never before…

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