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Via Drilling

Solar Cell Manufacturing

Solar Cell Manufacturing

…Wrap-Through schemes. Here conductive pathways (via’s) are drilled through c-Si cells to allow contacts to be located at the rear of the cells; busbars for MWT and both fingers/busbars for EWT. With a ten-year heritage in drilling Through Silicon Via’s (TSV’s) within the semiconductor industry, the…

The PCB Magazine, November 2015

The PCB Magazine, November 2015

…to smaller vias, mechanical drill replacement costs start to increase exponentially, and the use of CO 2 lasers will expand significantly to cater to the growing demand for ever smaller micro-vias. AsVias Shrink, Opportunities for Laser Drilling Expand CO 2 lasers drill vias through a thermal…

COHR AVIA LX UV DS 0818 3.pdf

COHR AVIA LX UV DS 0818 3.pdf

…hands-free operation. These characteristics make AVIA LX an ideal tool for high throughput, demanding, yet cost sensitive applications such as via drilling in PCB and flex materials, cutting of flex materials, 3D chip package manufacturing, IC package trimming, and wafer scribing. For the system…

AVIA LX Solid State Q-Switched UV Laser

AVIA LX Solid State Q-Switched UV Laser

…hands-free operation. These characteristics make AVIA LX an ideal tool for high throughput, demanding, yet cost sensitive applications such as via drilling in PCB and flex materials, cutting of flex materials, 3D chip package manufacturing, IC package trimming, and wafer scribing. For the system…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

…projection setup for parallel
drilling through vias in thin glass.
Fig. 3. 25 µm size vias drilled in 100 micron thin borosilicate glass.
Entrance side (A), exit side (B) and side view (C). 700
pulses total.
Fig. 4. 25 µm size vias obtained in alkali-free glass. Entrance…

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

…lasers. CO lasers have
demonstrated drilling ~40 µm vias in 0.65mm thick fired ceramic at ~1000 holes/second. So
depending on the thickness of the ceramic and the desired diameter, both USP and CO lasers are
excellent choices for via drilling in LTCC.
Figure 3: Cross section of…

COHR AVIA NX UV DS 0117 5.pdf

COHR AVIA NX UV DS 0117 5.pdf

…ensures that the AVIA NX quality and reliability levels are beyond that of any other ns laser. AVIA NX is ideal for applications such as via drilling in PCB and Flex materials, 3D chip package manufacturing, IC package trimming, and wafer scribing. The AVIA NX offers effortless ease of integration…

COHR DIAMOND J-3-5 COlaser DS 0617 2.pdf

COHR DIAMOND J-3-5 COlaser DS 0617 2.pdf

…and CW operation · Beam focusability down to 25 µm · CO2 Laser-like low cost of ownership APPLICATIONS · Glass Processing · Film Cutting · Micro Via Drilling · Ceramic Processing · Metal Processing · Selective Laser Sintering · Surgical - Tissue Cutting and Cauterization · Aesthetics - Fractal Skin…

Industrial Laser Solutions - September/October 2015

Industrial Laser Solutions - September/October 2015

…through-holes (vias), which are used to make electrical connections between the circuit components. Target via diameters are currently in the 25µm size range. These vias can be produced using several techniques, including photolithography, etching, sandblasting, ultrasound drilling, or laser…

COHR MaterialsProcessingBrochure 0816revA 3.pdf

COHR MaterialsProcessingBrochure 0816revA 3.pdf

…carbon monoxide (CO) lasers offer enhanced processing characteristics for materials
processing applications ranging from glass cutting and via drilling, to
fractional skin resurfacing.
HighLight FAP system: diode laser for
plastic welding and soldering
Diamond J-Series:…

COHR AILU CO Lasers 08-18.pdf

COHR AILU CO Lasers 08-18.pdf

…CO laser wavelength is
highly reflected by copper. This allows the drilling
to automatically "self terminate" when the copper
layer is reached, which is critical to the way in
which laser via drilling is currently implemented.
Plastics film sealing
So called "multilayer…