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Via Drilling

Coherent

Coherent

…enable market share gains in via drilling in silicon, flex circuit packaging and other
emerging applications. In addition, we launched a new CO2
laser platform called the Hornet, which
has specific performance and design attributes for the via drilling market, allowing integrators to…

34706a cover.indd

34706a cover.indd

…newest smartphones, which increases the number of interconnects and functionality
in a smaller footprint. This will maintain pressure on the via drilling market in the next few quarters,
but we believe the impact will be temporary since new applications like virtual reality need large

COHR DIAMOND E-1000 DS 1118 1.pdf

COHR DIAMOND E-1000 DS 1118 1.pdf

…converting, cutting, engraving, perforating and drilling of paper, plastic films, plastics, glass, carbon composites, textiles, wood and even thin metals. The RF power supply is detachable and a full suite of on-board diagnostics (accessible via the Internet) is available that allows for proactive…

CO Lasers from Lab to Fab

CO Lasers from Lab to Fab

…components. Target via
diameters are currently in the 25 µm size
range. These vias can be produced using
several techniques, including photolithography, etching, sand blasting, ultrasound drilling, or laser ablation.
As with cutting, hole drilling in glass
interposers…

COHR DIAMOND E-1000 DS 0817 1.pdf

COHR DIAMOND E-1000 DS 0817 1.pdf

…converting, cutting, engraving, perforating and drilling of paper, plastic films, plastics, glass, carbon composites, textiles, wood and even thin metals. The RF power supply is detachable and a full suite of on-board diagnostics (accessible via the Internet) is available that allows for proactive…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…basic mechanisms by which a laser can precision drill, scribe, cut or mark a material. Many traditional applications rely on infrared and visible Qswitched lasers, which have pulse widths in the tens of nanoseconds range, and which remove material via a photothermal interaction. Here, the focused…

CMM 8.2.indd

CMM 8.2.indd

…range.
These vias can be produced using several
techniques, including etching, sand blasting,
ultrasound drilling or laser ablation.
To investigate the potential for using lasers
for this application, the Coherent applications
laboratory laser drilled a large number of…

Photonics Spectra - September 2015

Photonics Spectra - September 2015

…3. A 50-µm-thick glass substrate drilled with successively more pulses from a CO laser demonstrates the ability of this source to drill glass interposers, as well
as drill micro dots on light guide panels used in display backlights. CO
2
drilling of this material typically results…

Layout 1

Layout 1

…process the raw signal from the detector; this module connects with a host
computer through USB 2.0 or directly
to laser system controllers via RS-232. A
new Windows PC application then
enables instrument control and displays
measurement results, including laser
tuning…

CMM 11.5.indd

CMM 11.5.indd

…paperthin and lightweight, rigid or flexible displays that deliver exceptional performance and pixel resolution. Among these processes are drilling and cutting of substrates and organic thin films, fine patterning of pixel and touchscreen structures, excimer laser annealing (ELA) for surface…

IndustrialUltrafast Whitepaper.pdf

IndustrialUltrafast Whitepaper.pdf

…basic mechanisms by which a laser can precision drill, scribe, cut or mark a material. Many traditional applications rely on infrared and visible Qswitched lasers, which have pulsewidths in the tens of nanoseconds range, and which remove material via a photothermal interaction. Here, the focused…

Photonics Spectra - July 2014

Photonics Spectra - July 2014

…the raw signal
from the detector; this module connects
with a host computer through USB 2.0
or directly to laser-system controllers via
RS-232. A new Windows PC application
then enables instrument control and displays measurement results, including laser
tuning and…