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Via Drilling

Microelectronics

Microelectronics

…must fulfill very tight tolerances (50 µm diameter vias in resin-coated copper (RCC), Fr4 and aramid-based dielectrics, as well as Cu-direct drilling processes. The AVIA-series diode-pumped UV lasers are ideal for drilling <70 µm diameter vias in RCC and PTFE-based dielectrics and copper. Related…

Solar Cell Manufacturing

Solar Cell Manufacturing

…Wrap-Through schemes. Here conductive pathways (via’s) are drilled through c-Si cells to allow contacts to be located at the rear of the cells; busbars for MWT and both fingers/busbars for EWT. With a ten-year heritage in drilling Through Silicon Via’s (TSV’s) within the semiconductor industry, the…