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Via Hole Drilling

The PCB Magazine, November 2015

The PCB Magazine, November 2015

…are
beyond the capabilities of mechanical drills. In
As Vias Shrink, Opportunities for Laser Drilling Expand
article
Figure 3: Excimer laser (193 nm) vias drilled into
glass. A) The 25 µm diameter entrance hole;
B) the exit hole; and C) the cross-sectional view.

Laser Focus World - August 2016

Laser Focus World - August 2016


Earlyon,severalmanufacturersinthelaser
industry identified via drilling as a process
that would eventuallyhavetomovefrom
mechanical to laser
drilling. Vias are the
small holes in circuit
boardsusedtomake
electrical connections between layers…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm


drilling rate (holes per second) actually increases with the
square of the pitch size. In contrast, in the case of serial
drilling, the number of vias per time is constant and
virtually unaffected by via size and via density (pitch).
3. Side-bar
3.1. Serial TGV drilling

CO Lasers from Lab to Fab

CO Lasers from Lab to Fab

…components. Target via
diameters are currently in the 25 µm size
range. These vias can be produced using
several techniques, including photolithography, etching, sand blasting, ultrasound drilling, or laser ablation.
As with cutting, hole drilling in glass
interposers…

Microelectronics

Microelectronics

…position of the holes, as well as the shape, must fulfill very tight tolerances (50 µm diameter vias in resin-coated copper (RCC), Fr4 and aramid-based dielectrics, as well as Cu-direct drilling processes. The AVIA-series diode-pumped UV lasers are ideal for drilling <70 µm diameter vias in RCC and…

Solar Cell Manufacturing

Solar Cell Manufacturing

…Wrap-Through schemes. Here conductive pathways (via’s) are drilled through c-Si cells to allow contacts to be located at the rear of the cells; busbars for MWT and both fingers/busbars for EWT. With a ten-year heritage in drilling Through Silicon Via’s (TSV’s) within the semiconductor industry, the…

COHR AVIA LX UV DS 0818 3.pdf

COHR AVIA LX UV DS 0818 3.pdf

…M2 <1.2 · Industry leading compact footprint · Simplified user interface at laser head · High reliability between long maintenance cycles APPLICATIONS · Via Hole Drilling · Flex Materials Cutting · 3D Package Manufacturing · IC Package Trimming · Wafer Scribing and Singulation · Solar Cell Scribing

AVIA LX Solid State Q-Switched UV Laser

AVIA LX Solid State Q-Switched UV Laser

…M2 <1.2 · Industry leading compact footprint · Simplified user interface at laser head · High reliability between long maintenance cycles APPLICATIONS · Via Hole Drilling · Flex Materials Cutting · 3D Package Manufacturing · IC Package Trimming · Wafer Scribing and Singulation · Solar Cell Scribing

COHR AVIA NX UV DS 0117 5.pdf

COHR AVIA NX UV DS 0117 5.pdf

…· Simplified user interface at laser head · HALT designed/HASS certified · High reliability between long maintenance cycles APPLICATIONS · Via Hole Drilling · Flex Materials Cutting · 3D Package Manufacturing · IC Package Trimming · Wafer Scribing and Singulation · Solar Cell Scribing AVIA NX

Industrial Laser Solutions - September/October 2015

Industrial Laser Solutions - September/October 2015

…that produced a fluence of 7J/cm2 at the work surface. The 193nm wavelength was chosen because glass exhibits strong absorption at this wavelength. FIGURE 1. Excimer laser (193nm) vias drilled into glass: The 25µm diameter entrance hole (a), the exit hole (b), and the cross-sectional view (c).

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

…both USP and CO lasers are
excellent choices for via drilling in LTCC.
Figure 3: Cross section of 0.6mm thick scribed LTCC. The comparison shows the CO laser's
scribe penetrating further and generating higher aspect ratio holes due to its lower absorption in
the ceramic. The CO2…