…position of the holes, as well as the shape, must fulfill very tight tolerances (50 µm diameter vias in resin-coated copper (RCC), Fr4 and aramid-based dielectrics, as well as Cu-direct drilling processes. The AVIA-series diode-pumped UV lasers are ideal for drilling <70 µm diameter vias in RCC and…
drilling rate (holes per second) actually increases with the
square of the pitch size. In contrast, in the case of serial
drilling, the number of vias per time is constant and
virtually unaffected by via size and via density (pitch).
3.1. Serial TGV drilling…
industry identified via drilling as a process
that would eventuallyhavetomovefrom
mechanical to laser
drilling. Vias are the
small holes in circuit
electrical connections between layers…
…components. Target via
diameters are currently in the 25 µm size
range. These vias can be produced using
several techniques, including photolithography, etching, sand blasting, ultrasound drilling, or laser ablation.
As with cutting, hole drilling in glass
…Wrap-Through schemes. Here conductive pathways (via’s) are drilled through c-Si cells to allow contacts to be located at the rear of the cells; busbars for MWT and both fingers/busbars for EWT. With a ten-year heritage in drilling Through Silicon Via’s (TSV’s) within the semiconductor industry, the…
…M2 <1.2 · Industry leading compact footprint · Simplified user interface at laser head · High reliability between long maintenance cycles APPLICATIONS · Via Hole Drilling · Flex Materials Cutting · 3D Package Manufacturing · IC Package Trimming · Wafer Scribing and Singulation · Solar Cell Scribing
…· Simplified user interface at laser head · HALT designed/HASS certified · High reliability between long maintenance cycles APPLICATIONS · Via Hole Drilling · Flex Materials Cutting · 3D Package Manufacturing · IC Package Trimming · Wafer Scribing and Singulation · Solar Cell Scribing AVIA NX
beyond the capabilities of mechanical drills. In
As Vias Shrink, Opportunities for Laser Drilling Expand
Figure 3: Excimer laser (193 nm) vias drilled into
glass. A) The 25 µm diameter entrance hole;
B) the exit hole; and C) the cross-sectional view.
…that produced a fluence of 7J/cm2 at the work surface. The 193nm wavelength was chosen because glass exhibits strong absorption at this wavelength. FIGURE 1. Excimer laser (193nm) vias drilled into glass: The 25µm diameter entrance hole (a), the exit hole (b), and the cross-sectional view (c).
…both USP and CO lasers are
excellent choices for via drilling in LTCC.
Figure 3: Cross section of 0.6mm thick scribed LTCC. The comparison shows the CO laser's
scribe penetrating further and generating higher aspect ratio holes due to its lower absorption in
the ceramic. The CO2…
…through holes, called vias,
which are used to make electrical connections
between the circuit components. Target via
diameters are usually in the 25 µm size range.
These vias can be produced using several
techniques, including etching, sand blasting,
…applications. These include LED dicing; sapphire cutting; drilling of automobile engine fuel injection nozzles and engine cooling plates; hole drilling and structuring of biomedical filters; cutting and drilling of FR-4 resin; cutting and drilling of both lowtemperature co-fired ceramics and…
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