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1 - 12 of 32 Products for 'Wafer Cutting' Page 1 of 3 |

Wafer Cutting

Microelectronics

Microelectronics

…Sapphire Lasers Ion Lasers Si Wafer Scribing, Cutting and Dicing Coherent lasers are used in a large number of advanced silicon wafer applications, both in high-volume production and in the development of tomorrow’s advanced chip architectures. As silicon wafers get thinner and new material layers…

Monaco femtosecond industrial laser

Monaco femtosecond industrial laser

…SmartCleave Applications Application Process Material Choose an Application Glass Cutting & Drilling OPA Pumping fs Micromachining Precise Metal Marking & Cutting Thin-film Ablation Wafer Scribing Display Cutting Drilling Scribing Marking Surface Modification Glass Polymer Ceramic Thin Film…

META 2C | Laser Cutting and Machining Tool

META 2C | Laser Cutting and Machining Tool

…HERE META 2C Highlights
* 250W CO2 Laser
* Cuts up to 25 mm acrylic
* Metal cutting option available Datasheet META 2C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Glass Cutting & Drilling Marking Brazing Cutting Drilling ABS Acrylic Wood and Derivatives…

PowerLine AVIA NX UV Laser Sub-System for micromachining applications

PowerLine AVIA NX UV Laser Sub-System for micromachining applications

…throughput, and superior quality cutting and scribing of a variety of microelectronics materials, including SIPs, packages and PCBs. The scan optics can have a field of view large enough to cover a 300 mm wafer or PCB, and the system produces fine features and narrow cuts with minimal heat affected…

Femtosecond Lasers

Femtosecond Lasers

Femtosecond Lasers Ultrashort pulse lasers for materials processing, microelectonics production, and scientific applications The Coherent family of femtosecond lasers serves the industrial and scientific markets. For industry, femtosecond lasers are suitable for ultra-fine processing of materials…

META 1.5C | Compact and Flexible Laser Cutter

META 1.5C | Compact and Flexible Laser Cutter

…HERE META 1.5C Highlights
* 150W CO2 Laser
* Cuts up to 15 mm acrylic
* Metal cutting option available Datasheet META 1.5C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Etch Barrier Patterning Marking Cutting Drilling Engraving Wood and Derivatives Acrylic…

AVIA NX nanosecond laser

AVIA NX nanosecond laser

…AVIA NX Green Datasheet AVIA NX Ultraviolet Applications Application µ-via drilling Glass Cutting & Drilling Thin-film Scribing Ceramic Processing Flex PCB drilling & cutting IC Package singulation Silicon Wafer scribing Fine metal machining --> Features & Benefits AVIA UV Product Evolution, an…

Laser Marking Systems

Laser Marking Systems

…quality and consistency. LabelMarker Advanced for high-speed marking and cutting of labels LabelMarker Advanced for high-speed marking and cutting of labels The LabelMarker Advanced is the optimum label marking and cutting solution for highest demands in performance and reliability. LME-RM modular…

Company

…remains a cornerstone of our business. As such, we design and produce many of our own components and sub-assemblies – including fibers, crystal and wafer growth. We also design and implement proprietary manufacturing tools, equipment and techniques that are utilized across our product lines ensuring…

COHR WhitePaper High Repetition Rate USP Lasers Improve OLED Cutting Results.pdf

COHR WhitePaper High Repetition Rate USP Lasers Improve OLED Cutting Results.pdf

…in this image - while the USP laser produced none, and also delivered
a substantially smaller cut width. Note the difference in scale between the two images.
Flexible OLED cutting represents an excellent example of where the reduced kerf width and
smaller HAZ of USP laser processing…

IndPhotonics Micromachining Glass Cutting.pdf

IndPhotonics Micromachining Glass Cutting.pdf

…scribe, cut or mark a material. Many traditional applications rely on infrared and visible Qswitched lasers, which have pulse widths in the tens of nanoseconds range, and which remove material via a photothermal interaction. Here, the focused laser beam For Glass and Silicon Wafer Cutting, Shorter…

COHR Monaco UV DS 0619 3.pdf

COHR Monaco UV DS 0619 3.pdf

…for industry leading reliability · PulseEQ pulse-on-demand for constant pulse spacing in contour cutting with stages and galvos APPLICATIONS · OLED Module and Contour Cutting · Semiconductor Wafer Cutting · Thin-Film and Foil Cutting · Display Touch Sensor Cutting · Flex Material Processing