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1 - 12 of 24 Products for 'Wafer Marking' Page 1 of 2 |

Wafer Marking

WaferLase ID Wafer Marking System

WaferLase ID Wafer Marking System

…of the process chain. Waferlase ID systems produce debris-free marks suitable for the most extreme cleanroom environments. The Waferlase ID system is available as Waferlase ID 200 suitable for silicon wafer ID marking up to 200 mm wafer sizes and as Waferlase ID LED especially for traceability of…

Laser Marking Systems

Laser Marking Systems

…provides an elegant and efficient solution for marking parts in a production environment WaferLase ID silicon wafer marker WaferLase ID silicon wafer marker Waferlase ID systems are designed to meet the most stringent requirements of silicon wafer marking, assuring traceability ón the manufacturing…

META 1.5C | Compact and Flexible Laser Cutter

META 1.5C | Compact and Flexible Laser Cutter

…mm acrylic
* Metal cutting option available Datasheet META 1.5C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Etch Barrier Patterning Marking Cutting Drilling Engraving Wood and Derivatives Acrylic ABS Ceramic --> Features & Benefits META 1.5C Processing…

Monaco femtosecond laser

Monaco femtosecond laser

…Material Choose an Application Glass Cutting & Drilling OPA Pumping fs Micromachining Precise Metal Marking & Cutting Thin-film Ablation Wafer Scribing Display Cutting Drilling Scribing Marking Surface Modification Glass Polymer Ceramic Thin Film Stainless Steel --> Features & Benefits…

META 2C | Laser Cutting and Machining Tool

META 2C | Laser Cutting and Machining Tool

…to 25 mm acrylic
* Metal cutting option available Datasheet META 2C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Glass Cutting & Drilling Marking Brazing Cutting Drilling ABS Acrylic Wood and Derivatives Ceramic Plastic --> Features & Benefits META 2C…

Microelectronics

Microelectronics

…Technology Depth Reticle - Laser-direct writing, inspection, repair Wafer - Inspection (bare and patterned), dicing, marking, scribing Metrology - Thin-film diagnostics, optics inspection Device - Test & measurement, marking, trimming and memory repair Printed Circuit Boards (PCBs) -…

Microsoft Word - Coherent Whitepaper - Marking Stainless Steel Medical Devices

Microsoft Word - Coherent Whitepaper - Marking Stainless Steel Medical Devices

…devices. And recently picosecond lasers have been employed in the marking of
sapphire wafers - a notoriously hard material to mark - for use in the production of high
brightness LEDs.
Given the limitations of marking stainless steel medical devices with longer pulse lasers, both

SST 2017-09 Laser Marking.pdf

SST 2017-09 Laser Marking.pdf

…whenever deep marks into silicon are required,
such as placing wafer IDs near the wafer edge. Near
IR laser markers are also selected for marking molded
fan-out wafer level packaging wafers.
However, for marking either flip-chips or the backside
of wafers, green lasers are…

Solar High Efficiency AR Coatings

Solar High Efficiency AR Coatings

marking,
because it can produce marks that
involve either a color change or a
slight alteration in surface relief,
essentially without any HAZ.
Marking on sapphire
A final example of high value marking is producing bar codes and other
marks on the sapphire wafers

Helios Whitepaper2014.pdf

Helios Whitepaper2014.pdf

…traditional marks on glass and sapphire. In this
case, marks are typically on the order of 10 µm deep in
order to make them clearly visible. One particular
application is in marking the sapphire wafers used as
substrates in the production of high brightness LEDs.
These marks

Laser Focus World - February 2018

Laser Focus World - February 2018

…used in
marking the aluminum cases of tablet
computers and other compact handheld
electronic devices, as well as marking the
sapphire wafers used in the production
of high-brightness LEDs (a notoriously
hard material to mark). Given the limitations of marking stainless…

CMM 10.4.indd

CMM 10.4.indd

…are widely
employed in challenging applications throughout
microelectronics manufacturing (e.g., for high
precision wafer cutting, scribing and marking)
cannot reach the required level of accuracy for
this application (see figure 2).
Figure 2: "Dark Yellow," 30 µm…

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