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Wafer Scribing

Microelectronics

Microelectronics

…Lasers Laser Tools and Systems Si Wafer Scribing, Cutting and Dicing Coherent lasers are used in a large number of advanced silicon wafer applications, both in high-volume production and in the development of tomorrow’s advanced chip architectures. As silicon wafers get thinner and new material…

COHR AVIA LX UV DS 0317 3.pdf

COHR AVIA LX UV DS 0317 3.pdf

…· Industry leading compact footprint · Simplified user interface at laser head · High reliability between long maintenance cycles APPLICATIONS · Via Hole Drilling · Flex Materials Cutting · 3D Package Manufacturing · IC Package Trimming · Wafer Scribing and Singulation · Solar Cell Scribing AVIA LX

COHR AVIA LX UV DS 0317 4.pdf

COHR AVIA LX UV DS 0317 4.pdf

…· Industry leading compact footprint · Simplified user interface at laser head · High reliability between long maintenance cycles APPLICATIONS · Via Hole Drilling · Flex Materials Cutting · 3D Package Manufacturing · IC Package Trimming · Wafer Scribing and Singulation · Solar Cell Scribing AVIA LX

Paladin Advanced 355

Paladin Advanced 355

…Application Process Material Materials Processing Microelectronics Doping Inspection Laser Direct Imaging (LDI) Thin Film Scribing Semiconductor Solar Cell/Panel wafer Mask PC Board Memory Photopolymer FPD --> Features & Benefits Paladin Advanced 355 is the flagship of the Paladin family.…

META 2C | Laser Cutting and Machining Tool | Coherent

META 2C | Laser Cutting and Machining Tool | Coherent


* 250W CO2 Laser
* Cuts up to 25 mm acrylic
* Metal cutting option available Datasheet META 2C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Glass Cutting & Drilling Marking Brazing Cutting Drilling ABS Acrylic Wood and Derivatives Ceramic Plastic -->…

META 1.5C | Compact and Flexible Laser Cutter

META 1.5C | Compact and Flexible Laser Cutter


* 150W CO2 Laser
* Cuts up to 15 mm acrylic
* Metal cutting option available Datasheet META 1.5C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Etch Barrier Patterning Marking Cutting Drilling Engraving Wood and Derivatives Acrylic ABS Ceramic --> Features…

The Monaco diode-pumped femtosecond industrial laser

The Monaco diode-pumped femtosecond industrial laser

…Layer Processing Glass Cutting & Drilling OPA Pumping fs Micromachining Precise Metal Marking & Cutting Thin-film Ablation Wafer Scribing Display Cutting Drilling Scribing Marking Surface Modification Glass Polymer Ceramic Thin Film Stainless Steel --> Features & Benefits Reliability from the…

MATRIX Family of Q-Switch Lasers | Coherent

MATRIX Family of Q-Switch Lasers | Coherent

…Cutting Dicing/Scribing Drilling Engraving Marking Repair Stereolithography Thin Film Patterning Trimming Ceramic FPD Glass Metal Polymer Sapphire wafer Solar Cell/Panel Flexible PCB Photopolymer Mould Hard Disk Indent card LCD Medical Device Plastic Memory Photopolymer ITO layers Quartz Resistor…

COHR AVIA NX UV DS 0117 5.pdf

COHR AVIA NX UV DS 0117 5.pdf

…· Simplified user interface at laser head · HALT designed/HASS certified · High reliability between long maintenance cycles APPLICATIONS · Via Hole Drilling · Flex Materials Cutting · 3D Package Manufacturing · IC Package Trimming · Wafer Scribing and Singulation · Solar Cell Scribing AVIA NX

34706a cover.indd

34706a cover.indd

…materials, such as low-k and thinner silicon. Our AVIA, Rapid, Talisker, Monaco and Matrix lasers provide economical methods of cutting and scribing these wafers while delivering higher yields than traditional mechanical methods. There are similar trends in chip packaging and PCB manufacturing…

AVIA NX nanosecond laser | Coherent

AVIA NX nanosecond laser | Coherent

…AVIA NX Ultraviolet Applications Application µ-via drilling Glass Cutting & Drilling Thin-film Scribing Ceramic Processing Flex PCB drilling & cutting IC Package singulation Silicon Wafer scribing Fine metal machining --> Features & Benefits AVIA UV Product Evolution, an 18-year learning…

Paladin Compact 355 quasi-CW laser

Paladin Compact 355 quasi-CW laser

…Air Cooled Drawing Paladin Compact 355 Applications Process Material Doping Inspection Laser Direct Imaging (LDI) Thin Film Scribing Semiconductor Solar Cell/Panel wafer Mask PC Board Memory Photopolymer FPD --> Features & Benefits Paladin Compact 355 comes in power classes: 2W and 4W. These…

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