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Wafer Scribing

Microelectronics

Microelectronics

…Sapphire Lasers Ion Lasers Si Wafer Scribing, Cutting and Dicing Coherent lasers are used in a large number of advanced silicon wafer applications, both in high-volume production and in the development of tomorrow’s advanced chip architectures. As silicon wafers get thinner and new material layers…

PowerLine AVIA NX UV Laser Sub-System for micromachining applications

PowerLine AVIA NX UV Laser Sub-System for micromachining applications

…to deliver rapid throughput, and superior quality cutting and scribing of a variety of microelectronics materials, including SIPs, packages and PCBs. The scan optics can have a field of view large enough to cover a 300 mm wafer or PCB, and the system produces fine features and narrow cuts with…

COHR AVIA LX UV DS 0818 3.pdf

COHR AVIA LX UV DS 0818 3.pdf

…M2 <1.2 · Industry leading compact footprint · Simplified user interface at laser head · High reliability between long maintenance cycles APPLICATIONS · Via Hole Drilling · Flex Materials Cutting · 3D Package Manufacturing · IC Package Trimming · Wafer Scribing and Singulation · Solar Cell Scribing

META 2C | Laser Cutting and Machining Tool

META 2C | Laser Cutting and Machining Tool


* 250W CO2 Laser
* Cuts up to 25 mm acrylic
* Metal cutting option available Datasheet META 2C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Glass Cutting & Drilling Marking Brazing Cutting Drilling ABS Acrylic Wood and Derivatives Ceramic Plastic -->…

META 1.5C | Compact and Flexible Laser Cutter

META 1.5C | Compact and Flexible Laser Cutter


* 150W CO2 Laser
* Cuts up to 15 mm acrylic
* Metal cutting option available Datasheet META 1.5C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Etch Barrier Patterning Marking Cutting Drilling Engraving Wood and Derivatives Acrylic ABS Ceramic --> Features…

Monaco femtosecond laser

Monaco femtosecond laser

…Choose an Application Glass Cutting & Drilling OPA Pumping fs Micromachining Precise Metal Marking & Cutting Thin-film Ablation Wafer Scribing Display Cutting Drilling Scribing Marking Surface Modification Glass Polymer Ceramic Thin Film Stainless Steel --> Features & Benefits Reliability from…

AVIA NX nanosecond laser

AVIA NX nanosecond laser

…AVIA NX Ultraviolet Applications Application µ-via drilling Glass Cutting & Drilling Thin-film Scribing Ceramic Processing Flex PCB drilling & cutting IC Package singulation Silicon Wafer scribing Fine metal machining --> Features & Benefits AVIA UV Product Evolution, an 18-year learning…

Paladin Compact 355 quasi-CW laser

Paladin Compact 355 quasi-CW laser

…Air Cooled Drawing Paladin Compact 355 Applications Process Material Doping Inspection Laser Direct Imaging (LDI) Thin Film Scribing Semiconductor Solar Cell/Panel wafer Mask PC Board Memory Photopolymer FPD --> Features & Benefits Paladin Compact 355 comes in power classes: 2W and 4W. These…

Paladin Advanced 355

Paladin Advanced 355

…Application Process Material Materials Processing Microelectronics Doping Inspection Laser Direct Imaging (LDI) Thin Film Scribing Semiconductor Solar Cell/Panel wafer Mask PC Board Memory Photopolymer FPD --> Features & Benefits Paladin Advanced 355 is the flagship of the Paladin family.…

AVIA LX Solid State Q-Switched UV Laser

AVIA LX Solid State Q-Switched UV Laser

…M2 <1.2 · Industry leading compact footprint · Simplified user interface at laser head · High reliability between long maintenance cycles APPLICATIONS · Via Hole Drilling · Flex Materials Cutting · 3D Package Manufacturing · IC Package Trimming · Wafer Scribing and Singulation · Solar Cell Scribing

COHR AVIA NX UV DS 0117 5.pdf

COHR AVIA NX UV DS 0117 5.pdf

…· Simplified user interface at laser head · HALT designed/HASS certified · High reliability between long maintenance cycles APPLICATIONS · Via Hole Drilling · Flex Materials Cutting · 3D Package Manufacturing · IC Package Trimming · Wafer Scribing and Singulation · Solar Cell Scribing AVIA NX