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Wafer Sensor

Microelectronics

Microelectronics

…of advanced silicon wafer applications, both in high-volume production and in the development of tomorrow’s advanced chip architectures. As silicon wafers get thinner and new material layers are added, lasers are playing a critical role in processing these wafers. As wafers get thinner, they become…

META 1.5C | Compact and Flexible Laser Cutter

META 1.5C | Compact and Flexible Laser Cutter

…Highlights
* 150W CO2 Laser
* Cuts up to 15 mm acrylic
* Metal cutting option available Datasheet META 1.5C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Etch Barrier Patterning Marking Cutting Drilling Engraving Wood and Derivatives Acrylic ABS Ceramic -->…

META 2C | Laser Cutting and Machining Tool

META 2C | Laser Cutting and Machining Tool

…Highlights
* 250W CO2 Laser
* Cuts up to 25 mm acrylic
* Metal cutting option available Datasheet META 2C Applications Application Process Material Wafer Scribing Diamond and Eye Glass Marking Glass Cutting & Drilling Marking Brazing Cutting Drilling ABS Acrylic Wood and Derivatives Ceramic Plastic…

COHR Monaco UV DS 0619 3.pdf

COHR Monaco UV DS 0619 3.pdf

…for industry leading reliability · PulseEQ pulse-on-demand for constant pulse spacing in contour cutting with stages and galvos APPLICATIONS · OLED Module and Contour Cutting · Semiconductor Wafer Cutting · Thin-Film and Foil Cutting · Display Touch Sensor Cutting · Flex Material Processing

Manuscript

Manuscript

…in the system
without realigning the optics. The collimated beam passes through the wafer being tested. The beam transmitted
through the wafer is imaged with a lens to the 2-d camera sensor. The part under test is mounted on a rotation stage
with a rotation axis that is centered…

Photonik Feb2014.pdf

Photonik Feb2014.pdf

…thin wafer via laser
lift-off. To this end, the excimer laser is
shown through the glass wafer and selectively evaporates the most adjacent fraction of polymer film. Complete debonding
of a 12inch thin wafer requires about a
thousand laser pulses. Using thin wafer

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

Microsoft Word - NovusLight 2018-07 Microelectronics Packaging

…to perform diverse materials processing tasks with high precision and minimal heat affected zone (HAZ). As a result, laser use is increasing in wafer dicing, package singulation, optical debonding, µ-via drilling, RDL (redistribution layer) structuring, dicing tape cutting (EMI shield), soldering,…

COHR MaterialsProcessingBrochure 0816revA 3.pdf

COHR MaterialsProcessingBrochure 0816revA 3.pdf

…of ma
terials,
in particular thin films, with applications extending from wafer scale
to large substrates. Laser annealing can activate dopants for advanced
CMOS circuitry, sensors, IGBT, 3-D integration and more. Excimer
lasers are widely adopted for the crystallization…