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1.  Coherent Inc. Non-destructive and selective wire stripping is done using UV laser ablation. Wire Stripping Non-destructive and selective wire stripping by precise UV ablation with excimer and CO 2 lasers. Find the Laser Solution that Fits your Application Needs. Search Applications Notes Search by material and/or process. -- SELECT MATERIAL -- Ceramic Composite Diamond Fabric and Leather Glass… Related Searches: wire stripping

2.    pdf 130 Best match in this PDF  |  All matches in this PDF …Unlike the 157nm results, 193nm ablation begins above 4 J/cm2 and only after several dozen incubation pulses. Threshold extrapolation of the 193nm curve is unreliable due to incubation processes. Fig. 3: Microscope photographs of a germanosilicate layerslab waveguide ablated by 193nm radiation (left; single… Related Searches: laser pdf | excimer pumped dye laser | laser heating | lambda physik dye laser

3.    pdf 128 Best match in this PDF  |  All matches in this PDF …technique is the material ablation or laser milling process for manufacturing 3D microstructures in very hard materials. With each laser pulse a small element of the material (diameter ~ 5 µm) is vaporized. Under specific conditions, complex 3D microstructures can be produced by ablating several thousands of… Related Searches: 355 nm laser | beam quality factor | co2 pulse laser | ultrasonic

4.    Application Report IOL-280807 Best match in this PDF  |  All matches in this PDF …atmosphere. In scanning ablation the amount of direct and indirect debris vary differently with the ramp angle and the shape of the irradiated spot. We should note that the scanning ablation changes the morphology of the ablated surfaces (the channel floor). There are several ablative mechanisms by which… Related Searches: vision ii | excistar s-200

5.  Coherent Inc. ITO Ablation on Glass Substrates with DPSS Lasers …and Derivatives -- SELECT PROCESS -- Ablation-Material Removal Cladding Cutting and Scribing Drilling Heat Treating Marking and Engraving Sub-Surface Modification Surface Modification Welding and Soldering View All Application Notes Summary: It is possible to ablate a layer of Indium Tin Oxide (ITO) from… Related Searches: ito ablation | laser glass cutting | glass drilling | glass scribing

6.    DrillingOfGlass 2 Best match in this PDF  |  All matches in this PDF …coefficient and, therefore, the ablation mechanism of different glasses depends strongly on the composition of the glass. In contrast to quartz glass, Pyrex glass absorbs the excimer laser radiation with 248 nm wavelength, but we have find out in our investigations that the ablation of Pyrex glass and of different… Related Searches: ultrasonic | glass drilling | laser induced fluorescence | laser glasses

7.    Intra ocular lenses 2 Best match in this PDF  |  All matches in this PDF …atmosphere. In scanning ablation the amount of direct and indirect debris vary differently with the ramp angle and the shape of the irradiated spot. We should note that the scanning ablation changes the morphology of the ablated surfaces (the channel floor). There are several ablative mechanisms by which… Related Searches: excistar 200 | surgical

8.    pdf 127 Best match in this PDF  |  All matches in this PDF …. How could this be realized? Laser ablation in combination with ICP-MS (inductively coupled plasma-mass spectrometry) offers a solution, because almost any type of sample can be transferred into an aerosol that can be analyzed by an ICP-MS. The sample is ablated in an airtight cell and the aerosol is… Related Searches: compex 205 | wood's horn | wood | compex

9.  Coherent Inc. Coherent Inc. c-Si Dielectric Ablation involves ablating thin layers of SiNx or SiO2 …known as Selective Removal, Dielectric Ablation involves ablating thin layers of SiNx or SiO2 included on the cell surfaces to increase surface passivation while further assisting light transmission (front) or reflection (rear). Laser-based tools can ablate fine lines or holes with micron precision…

10.    PVI5-01 3 Best match in this PDF  |  All matches in this PDF …upstream (`preparatory'), creating selective (dielectric ablated) openings in the SiNx/SiO2 AR/passivation coating for subsequent heavy doping and metallization (screenprinted or electroless-plated). In this case, material removal can extend to ablate several microns of the underlying silicon, making this… Related Searches: 150mw | laser combiner | laser heating | photovoltaic scribe

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