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advanced packaging and interconnects

DIAMOND E-Series

DIAMOND E-Series

…laser for a wide range of materials processing applications. Datasheet DIAMOND E-1000 Applications Application Process Material Advanced Packaging and Interconnects Materials Processing Graphic Arts Cutting Drilling Printing Scribing Flex Circuit Die Board Metal Plastic Flat Panel Display Paper…

DIAMOND J-Series Lasers

DIAMOND J-Series Lasers

…wavelength, feature a common mechanical, electrical, optical, software and control interface with the only difference between models being overall package length. This consistency enables system integrators to focus more on process development, rather than laser integration and tool re-engineering,…

Coherent

Coherent

…Application Technology
Microelectronics Flat panel display CO2
DPSS
Excimer
Ultrafast
Semiconductor
Advanced packaging and CO2
interconnects DPSS
Excimer
Ultrafast
Semiconductor front-end CO2
DPSS
OPSL
Excimer
Ion
Materials…

34706a cover.indd

34706a cover.indd


We support three major markets in the microelectronics industry: (1) flat panel display (``FPD'')
manufacturing, (2) advanced packaging and interconnects (``API'') and (3) semiconductor front-end
(``SEMI'').
Microelectronics--flat panel display manufacturing
The high-volume…

32311a coverSinglesRR.indd

32311a coverSinglesRR.indd

…cost.
We support three major markets in the microelectronics industry: (1) flat panel display (``FPDs'')
manufacturing, (2) advanced packaging and interconnects and (3) semiconductor front-end.
Microelectronics--flat panel display manufacturing
The high-volume consumer market is…

07(IK14-10)p.53-57.fm

07(IK14-10)p.53-57.fm

advanced packaging, glass interposers, excimers
1. Why Glass Interposers?
The demand for ever higher functionality in small
consumer electronics is pushing the microelectronics industry
to use new packaging strategies - 2.5D and 3D. Moreover,
these advanced packages enable…

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